XCKU3P-L1FFVB676I

The XCKU3P-L1FFVB676I chip model is a Field Programmable Gate Array (FPGA) from Xilinx. It is a 3D FPGA device with a die size of 17.2mm x 13.4mm and a total of 676K logic cells. The chip model is designed to provide high performance, flexibility, and scalability. It features 28.9Gbps transceivers and is capable of supporting up to 16GB of DDR4 memory. This makes it suitable for applications such as high-speed networking and data center acceleration.

The XCKU3P-L1FFVB676I also offers a wide range of I/O expansion options, including PCI Express, Ethernet, and USB. It also supports a variety of memory options such as DDR3, DDR4, and LPDDR4. The chip model is fabricated using the 16nm FinFET process and is designed to consume low power. It has a maximum power consumption of 10W and a maximum junction temperature of 125°C.

The XCKU3P-L1FFVB676I is suitable for a wide range of applications, including video and image processing, machine learning and artificial intelligence, high-performance computing, and 5G wireless communications. It is also suitable for applications in the automotive, aerospace, industrial, and medical fields. The chip model is designed to provide high performance, scalability, and flexibility, making it an ideal choice for many applications.