XCKU3P-3SFVB784E

The XCKU3P-3SFVB784E is an advanced FPGA (Field Programmable Gate Array) chip produced by Xilinx. It is a mid-range device from the Kintex UltraScale family that offers high performance and low power consumption.

The chip is built on a 28nm process technology with 3.8 million logic cells and 1.2 million flip-flops. It has a total of 6,720 DSP slices with 18x18 multipliers, and 4,096 embedded memory blocks with a total of 3.2 Mb of RAM. It also features four high-speed transceivers with speeds up to 12.5 Gbps and up to four banks of QDRII+ SRAM with a total of 2.6 Mb.

The XCKU3P-3SFVB784E is designed for a wide range of applications, including industrial automation, aerospace and defense, medical imaging, and communications. It is also ideal for applications requiring high-speed transceivers, high-speed logic, and high-bandwidth memory.

The chip is equipped with advanced features such as adaptive equalization, integrated clock management, and advanced power management for low power consumption. It also supports multiple I/O standards, including PCIe, SATA, and USB, and is compatible with the Vivado Design Suite for easy design and implementation.

The XCKU3P-3SFVB784E is a powerful and versatile FPGA chip that can be used in a wide variety of applications. It offers high performance, low power consumption, and advanced features for reliable and efficient operation.