XCKU3P-3FFVD900E

The XCKU3P-3FFVD900E is a field programmable gate array (FPGA) chip model manufactured by Xilinx. It is a member of the Xilinx UltraScale+ family, and is based on the Kintex UltraScale+ architecture. It has a total of 3,000,000 logic cells, and is designed for use in high-performance applications.

The XCKU3P-3FFVD900E has a total of 9,000,000 logic elements and a memory bandwidth of up to 528 Gb/s. It also has up to 976Kbits of on-chip RAM, and up to 2,000 DSP slices. It is capable of delivering up to 8.5 TFLOPS of peak performance. The chip also features an integrated transceiver block, which supports up to 28 transceivers with data rates up to 28 Gb/s.

The XCKU3P-3FFVD900E is ideal for a wide range of applications, including communications, video and imaging, military and aerospace, automotive, and industrial control. It is suitable for use in high-performance computing applications, such as artificial intelligence and machine learning. It is also suitable for use in high-bandwidth applications, such as 5G networks.

In summary, the XCKU3P-3FFVD900E is a powerful FPGA chip model from Xilinx. It has a total of 3,000,000 logic cells and 9,000,000 logic elements, and features an integrated transceiver block with data rates up to 28 Gb/s. It is suitable for a wide range of applications, including communications, video and imaging, military and aerospace, automotive, and industrial control.