XCKU3P-3FFVB676E

The XCKU3P-3FFVB676E chip is a FPGA (Field Programmable Gate Array) model from the Xilinx Kintex UltraScale family. This device is designed to provide high-performance, low-power, and low-cost solutions for various applications. It has a 3D FPGA architecture with a maximum operating frequency of 676MHz and a total logic element count of 1.3 million.

The device features a 28nm process technology and has a total power consumption of 8.7W. It also supports a wide range of I/O protocols such as PCI Express, Serial RapidIO, and 10G Ethernet. It has a total of 676 I/O pins and a total of 676 user-configurable logic blocks. The device also has a dual-channel DDR3 memory controller with a maximum bandwidth of up to 18.6GB/s.

The XCKU3P-3FFVB676E chip is suitable for applications in the areas of networking, video, and imaging. It is also suitable for high-speed data processing, signal processing, and embedded systems. It can be used for applications such as network switches, routers, video streaming and encoding, image processing, and machine learning. The device also supports the development of custom IP cores for specific applications.