XCKU3P-2SFVB784I

The XCKU3P-2SFVB784I is a high-performance field-programmable gate array (FPGA) chip from Xilinx. It is a member of the UltraScale+ family of FPGAs and is designed for applications requiring high-speed, low-power performance.

The XCKU3P-2SFVB784I has a total of 8.1 million logic cells and 2.2 million flip-flops, with a total of 1,824 user I/Os. It also has an integrated memory controller and a variety of high-speed transceivers. The chip is manufactured using a 16nm FinFET process and is capable of delivering up to 1.5 TFLOPS of peak performance.

The XCKU3P-2SFVB784I is suitable for a wide range of applications, including high-performance computing, artificial intelligence, machine learning, data analytics, and video and image processing. Its integrated memory controller and high-speed transceivers enable it to be used in applications requiring high-speed communication, such as 5G networks and high-performance computing clusters.

The XCKU3P-2SFVB784I is a versatile chip that can be used in a variety of applications, including embedded systems, automotive systems, industrial automation, aerospace, and military systems. It is also suitable for use in high-end consumer electronics and gaming devices. The chip is available in a range of packages, including BGA, VFBGA, and QFN, to suit different applications.