
AMD Xilinx
XCKU3P-2FFVD900E
XCKU3P-2FFVD900E ECAD Model
XCKU3P-2FFVD900E Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Kintex® UltraScale+™ | |
Package | Tray | |
Number of LABs/CLBs | 20340 | |
Number of Logic Elements/Cells | 355950 | |
Total RAM Bits | 31641600 | |
Number of I/O | 304 | |
Voltage - Supply | 0.825V ~ 0.876V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 100°C (TJ) | |
Package / Case | 900-BBGA, FCBGA | |
Supplier Device Package | 900-FCBGA (31x31) | |
Base Product Number | XCKU3 |
XCKU3P-2FFVD900E Datasheet Download
XCKU3P-2FFVD900E Overview
The XCKU3P-2FFVD900E is an FPGA (Field Programmable Gate Array) chip model manufactured by Xilinx. It is a mid-range, low-cost device with a wide range of features.
The XCKU3P-2FFVD900E has a total of 900K logic cells, 8.7Mbits of embedded memory, and 15,360 DSP slices. It also contains a variety of I/O ports, such as PCIe, USB, and Ethernet. The device supports a wide range of operating frequencies, from 0.7 to 1.5GHz, and is also equipped with power-saving features.
The XCKU3P-2FFVD900E is ideal for applications requiring high-performance, low-power, and cost-effective solutions. It is suitable for a variety of embedded applications, such as industrial control, medical imaging, automotive, and aerospace. It can also be used for high-speed data processing, signal processing, and image processing.
The XCKU3P-2FFVD900E is a highly versatile device, offering a wide range of features and performance. It is reliable, cost-effective, and has a low power consumption, making it an ideal choice for a variety of applications.
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4,983 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,597.7995 | $1,597.7995 |
10+ | $1,580.6189 | $15,806.1888 |
100+ | $1,494.7157 | $149,471.5680 |
1000+ | $1,408.8125 | $704,406.2400 |
10000+ | $1,288.5480 | $1,288,548.0000 |
The price is for reference only, please refer to the actual quotation! |