XCKU3P-2FFVB676I

The XCKU3P-2FFVB676I is a field-programmable gate array (FPGA) chip from Xilinx. It is a mid-range device from the Kintex UltraScale+ family, providing high-performance, low-cost FPGA solutions. The chip has a total of 676K logic cells, 2,450Kb of block RAM, and 24.3Mb of distributed RAM. It also features up to 2,160 DSP slices and up to 4,320 total I/O pins. The device is designed for high-speed serial connectivity and can support up to 16 GTH transceivers. It also supports up to four x16 PCI Express Gen3 endpoints.

The XCKU3P-2FFVB676I is ideal for applications such as wireless infrastructure, data centers, high-performance computing, and industrial automation. It can be used for high-speed data processing, signal processing, and image processing, as well as for high-speed communication and networking. The device is also well-suited for applications such as machine learning, video and image analysis, and high-speed storage.

The XCKU3P-2FFVB676I is available in a variety of packages, including a 7x7 mm BGA package and a 10x10 mm BGA package. It is also available with a variety of power supply options, including 1.0V, 1.2V, and 1.5V. The device has a maximum operating temperature of 105°C and is RoHS compliant. The device is also compatible with Xilinx's Vivado Design Suite, allowing for easy design and implementation.