XCKU3P-2FFVB676E

The XCKU3P-2FFVB676E is a high-performance, low-power FPGA chip from Xilinx. It features a Kintex UltraScale+ FPGA fabric which makes it suitable for a wide range of applications, from consumer electronics to automotive, industrial, and aerospace applications.

The XCKU3P-2FFVB676E has a total of 676K logic cells and 6,144 DSP slices. It also offers up to 2.5Mb of block RAM and up to 4,096 18x18 multipliers. The chip can operate at a maximum frequency of 1.2GHz and has a power consumption of up to 8.7W.

The XCKU3P-2FFVB676E is designed to support a wide range of I/O interfaces, including PCIe Gen3, USB 3.1, SATA, Ethernet, and DDR4. It also supports a variety of high-speed serial transceivers, such as 10Gbps SERDES, and can be used with Xilinx’s Vivado Design Suite for programming.

In terms of applications, the XCKU3P-2FFVB676E is suitable for a wide range of applications, including machine learning, artificial intelligence, video processing, embedded systems, and more. It is also suitable for applications that require high-speed real-time data processing, such as high-speed data acquisition, image processing, and signal processing.