XCKU3P-2FFVA676I

The XCKU3P-2FFVA676I is a high-performance, low-power Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is based on the Kintex UltraScale+ architecture and features a 28nm process technology. This chip is well-suited for applications that require high performance, low power consumption and high reliability.

The XCKU3P-2FFVA676I has a total of 2.5 million logic cells, 676 DSP slices, and 8,192 Kb of block RAM. It also features 4,096 I/O pins, 4,096 user I/O and up to 2,048 user-defined logic blocks. It is capable of delivering up to 2.5 TFLOPS of double-precision floating-point performance.

The XCKU3P-2FFVA676I is ideal for applications such as high-performance computing, artificial intelligence, machine learning, data centers, automotive, aerospace and defense. It is also well-suited for applications that require low latency, high throughput, and low power consumption such as video processing, image processing, and signal processing.

The XCKU3P-2FFVA676I is compliant with the Xilinx Vivado Design Suite, and is supported by the Xilinx Software Development Kit (SDK). It also supports the OpenCL and OpenVX programming languages.

Overall, the XCKU3P-2FFVA676I is a high-performance, low-power FPGA chip that is well-suited for a variety of applications requiring high performance, low latency, and low power consumption.