XCKU3P-2FFVA676E

The XCKU3P-2FFVA676E is a Field Programmable Gate Array (FPGA) chip from Xilinx, a leading provider of programmable logic solutions. It is based on the Xilinx UltraScale+ architecture and is designed for high-performance applications.

The XCKU3P-2FFVA676E features 676K logic cells, 2,976 DSP slices, and up to 33.75 MB of block RAM. It has a total of 8,192 I/O pins, with up to 3,072 user I/O pins, and can support up to 4 independent transceivers. It also supports up to 8 banks of DDR4 memory, with a total capacity of up to 16GB.

The XCKU3P-2FFVA676E is suitable for a wide range of applications, including high-performance computing, data center acceleration, machine learning, video processing, and embedded systems. It is also suitable for applications requiring high-speed data transfer, such as 5G networks and high-speed serial communications.

In terms of power consumption, the XCKU3P-2FFVA676E has a total power dissipation of up to 13.2W. It has an operating temperature range of 0°C to 85°C, and is available in a variety of packages, including a 676-pin FBGA package.

Overall, the XCKU3P-2FFVA676E is a powerful FPGA chip with a wide range of applications. It offers high performance, low power consumption, and a wide range of I/O options, making it suitable for a variety of applications.