XCKU3P-1SFVB784I

The XCKU3P-1SFVB784I is a low-power, high-performance chip from Xilinx. It is a single-core, 7-series FPGA device with a Kintex UltraScale+ architecture. This device has a total of 4,096 DSP slices and 8,192 logic cells, and is ideal for applications requiring high-speed signal processing, such as video and image processing, wireless communication, and data processing. It has a wide range of I/O options, including LVDS, PCIe, SRIO, and DDR4 interfaces, and supports multiple clock domains. The XCKU3P-1SFVB784I also features a wide range of power management features, including dynamic voltage and frequency scaling, power-on reset, and clock gating.

The device is available in two packages: a 784-pin FBGA and a 456-pin FBGA. It has a maximum clock frequency of 600 MHz, and its power consumption is as low as 4.5 W. It also features a built-in temperature sensor, which allows for temperature-based power management.

The XCKU3P-1SFVB784I is suitable for a variety of applications, including industrial automation, medical imaging, aerospace and defense, and automotive. It is also suitable for applications that require high-speed signal processing, such as video and image processing, wireless communication, and data processing. Additionally, it is suitable for applications that require low power consumption and high reliability.