XCKU3P-1FFVD900I

The XCKU3P-1FFVD900I is an FPGA chip model from Xilinx. It is part of the UltraScale+ family of FPGAs and is designed for high-end applications. The device is based on the 16nm FinFET process and has a total of 1.5 million logic cells, as well as a total of 1.9 million flip-flops and 5.5 million RAM bits. It also features an on-chip transceiver block, a large number of high-speed serial transceivers, and a high-speed serial transceiver interface.

The device has a total of 1,536 I/O pins, and it supports a variety of high-speed protocols such as PCIe Gen3, USB 3.1, and 10/25/40/100G Ethernet. It also provides integrated power management and clock management features, as well as a variety of other features such as on-chip debugging and trace capabilities.

The XCKU3P-1FFVD900I is suitable for a wide range of applications, including high-speed networking, data centers, and high-performance computing. It is also suitable for applications such as machine learning, artificial intelligence, and 5G wireless communication. The device is ideal for applications that require high levels of performance, power efficiency, and scalability.