XCKU3P-1FFVD900E

The XCKU3P-1FFVD900E is an FPGA (Field Programmable Gate Array) chip manufactured by Xilinx. It is a mid-range device in the Kintex UltraScale+ family and provides an optimal balance of performance and cost. This chip has a total of 1 million logic cells, 1.2 million flip-flops, 8,192 Kbits of block RAM, and 5,184 DSP slices. It also features a total of 8 transceivers with data rates up to 28.05 Gbps.

The XCKU3P-1FFVD900E has a power consumption of up to 12.5W and operates from a 1.2V core voltage. It is available in a 724-pin flip-chip package with a maximum die size of 20mm x 20mm. The chip is designed for applications such as high-performance computing, wired and wireless communications, and industrial automation. It also supports a wide range of I/O standards, including PCIe, Serial RapidIO, Ethernet, and DDR4.

The XCKU3P-1FFVD900E is a versatile chip that can be used for a variety of applications. It can be used in the development of high-performance computing systems, video processing, high-speed networking, and industrial automation. It is also suitable for the development of embedded systems with high-speed data processing and real-time control capabilities. In addition, the chip can be used for the development of advanced autonomous systems and machine learning applications.