XCKU3P-1FFVB676I

The XCKU3P-1FFVB676I is an FPGA chip from Xilinx, designed for a wide range of applications. It is a single-chip solution with a 28nm UltraScale+ architecture that offers high performance and low power consumption. The chip features a 676-pin package with a total of 1.2 million logic cells, 1.3 million flip-flops, and a total of 676 DSP slices. It also has a total of 36,864 Kbits of memory, and a total of 21,504 digital signal processing (DSP) slices.

The XCKU3P-1FFVB676I is designed for high performance applications such as machine learning, artificial intelligence, and video processing. It is also suitable for various embedded applications such as IoT, automotive, industrial, and medical. The chip has a wide range of features including high-speed transceivers, advanced I/O, and configurable logic blocks. It also has a wide range of interfaces such as Ethernet, PCIe, USB, and DDR4.

The XCKU3P-1FFVB676I is designed for high reliability and is compliant with the latest standards such as RoHS and ISO standards. It also has an advanced thermal management system that ensures the chip runs at optimal temperatures. The chip has a wide range of power management features such as dynamic voltage and frequency scaling, dynamic power management, and power-down modes.

In conclusion, the XCKU3P-1FFVB676I is an FPGA chip from Xilinx that is designed for high performance applications. It has a wide range of features such as high-speed transceivers, advanced I/O, and configurable logic blocks. It is also compliant with the latest standards and has an advanced thermal management system. The chip is suitable for various embedded applications such as IoT, automotive, industrial, and medical.