XCKU13P-3FFVE900E

The XCKU13P-3FFVE900E is an advanced FPGA chip from Xilinx that is designed for high-performance computing applications. It is a high-end model in the family of Kintex UltraScale FPGAs and is based on the 28nm UltraScale architecture. The chip features 3 million logic cells, up to 1.2 million LUTs, and up to 1.5 million flip-flops. It also has up to 1536 DSP slices, up to 4.6 Gbps transceivers, and up to 2.5 Gbps SERDES.

The chip supports various memory technologies such as DDR3, DDR4, QDR II/II+ SRAM, and RLDRAM3. It also supports a wide range of I/O standards such as PCIe Gen3, SATA, USB 3.0, Ethernet, and more. The chip also has a range of features such as clock management, power management, and security.

The XCKU13P-3FFVE900E is suitable for a range of applications including high-performance computing, embedded systems, video and imaging processing, automotive, and industrial automation. It is also suitable for applications such as artificial intelligence, machine learning, and network processing.

The chip is designed for ease of use and can be used in combination with Xilinx development tools such as Vivado Design Suite, SDK, and System Generator. The chip is also supported by a range of third-party tools. It is available in a range of package types including BGA, FCBGA, and VFBGA.