XCKU11P-3FFVD900E

The XCKU11P-3FFVD900E is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is based on the Kintex UltraScale FPGA architecture and is designed for high-performance applications. It has a total of 3,900,000 logic cells, with 1.2 million 4-input look-up tables (LUTs) and 1.2 million flip-flops. It also has 3,200 DSP slices and a total of 5.2Mb of RAM.

The XCKU11P-3FFVD900E is capable of operating at a maximum frequency of 1.3GHz and has a total power consumption of around 10W. It is available in a 676-pin flip-chip ball grid array (FCBGA) package and is designed for a wide range of applications including high-end networking, video, and imaging systems.

The XCKU11P-3FFVD900E supports a wide range of features, including high-speed transceivers, high-speed memory interfaces, and PCIe Gen3 x16 support. It also supports a range of I/O standards, including LVDS, MIPI, and SATA. Additionally, it supports both DDR3 and DDR4 memory interfaces.

The XCKU11P-3FFVD900E is ideal for applications requiring high-performance, low-power FPGA solutions. It is suitable for use in a variety of fields, including aerospace and defense, consumer electronics, industrial automation, broadcasting, and medical imaging. It is also suitable for use in applications such as high-speed networking, video and imaging systems, and embedded systems.