XCKU115-L1FLVA1517I

The XCKU115-L1FLVA1517I is a high-performance, low-power FPGA chip designed by Xilinx. It is based on the Kintex Ultrascale architecture and is part of the Xilinx Kintex Ultrascale family. The device is packaged in a 1517-ball Flip-Chip BGA package and is suitable for a wide range of applications.

The XCKU115-L1FLVA1517I chip offers a wide range of features, including up to 4.2 million system logic cells, up to 1.3 million flip-flops, up to 4.2 million RAM bits, up to 4.2 million DSP slices, up to 12.7 Gbps transceivers, and up to 6.6 Gbps SERDES. It also supports up to 16 banks of DDR4 memory, up to 6 banks of QDR4 II+ memory, and up to 4 banks of RLDRAM3 memory. In addition, the device supports up to 6 clock management tiles, up to 4 PCIe Gen3 hard IP blocks, and up to 4 Ethernet hard IP blocks.

The XCKU115-L1FLVA1517I is suitable for a wide range of applications, including high-performance computing systems, industrial automation, medical imaging, aerospace and defense, and automotive systems. It is also suitable for applications that require high-speed data processing, video processing, and image processing. The device is capable of handling large amounts of data and is ideal for applications that require high-speed, low-power operation.