XCKU115-3FLVB1760E

The XCKU115-3FLVB1760E is a high-performance FPGA chip from Xilinx. It is based on the 16nm UltraScale+ architecture and features 3.5 million system logic cells, 5,760 DSP slices, and 1,760 Kbits of block RAM. It also has a maximum operating frequency of 1.76GHz, and it supports up to 28.8Gbps transceiver speeds. The XCKU115-3FLVB1760E is ideal for applications that require high levels of performance, such as high-speed networking, embedded vision, and signal processing.

The XCKU115-3FLVB1760E has a power-efficient architecture with a low-power core. It also has an advanced power management system that enables dynamic power scaling to reduce power consumption and extend battery life. Additionally, the XCKU115-3FLVB1760E has a high-performance DSP core with dedicated DSP slices for high-performance signal processing. It also has a high-speed transceiver for high-speed data transmission.

The XCKU115-3FLVB1760E is ideal for a wide range of applications, including high-speed networking, embedded vision, signal processing, machine learning, and artificial intelligence. It is also suitable for use in 5G wireless networks, autonomous vehicles, industrial automation, and defense applications. Additionally, the XCKU115-3FLVB1760E is compatible with the Vivado Design Suite, allowing users to quickly and easily design, debug, and deploy their applications.