XCKU115-2FLVB1760E

The XCKU115-2FLVB1760E is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is based on the Kintex UltraScale+ architecture and is designed for high-end applications such as high-performance computing (HPC), artificial intelligence (AI) and machine learning (ML).

The XCKU115-2FLVB1760E is a mid-range FPGA with a die size of 115 mm2 and an operating temperature range of 0°C to 85°C. It has a total of 1760K logic cells, 8.3Mb of block RAM and 6,144 DSP Slices. It also features an integrated transceiver with data rates up to 28 Gbps. The chip has a total of 576 I/Os with a wide range of I/O standards such as LVDS, LVCMOS, SSTL, HSTL, and SATA.

The XCKU115-2FLVB1760E supports multiple development platforms such as Vivado Design Suite, SDAccel and SDSoC. It is also compatible with Xilinx's OpenCL, HLS and RTL development tools.

The XCKU115-2FLVB1760E is suitable for a wide range of applications including data center, high-speed networking, video and image processing, aerospace and defense, automotive, and industrial automation. It is also suitable for applications that require high-performance computing, AI and ML.