XCKU085-3FLVB1760E

The XCKU085-3FLVB1760E is a high-performance FPGA chip from Xilinx. It is based on the Kintex UltraScale architecture and is built using a 28nm process. It has a total of 8.5 million logic cells and 1.76 million flip-flops, as well as 8,192 Kb of block RAM. It also has a total of 4,608 DSP slices, allowing for powerful signal processing capabilities.

The chip is capable of operating at up to 350MHz and can reach peak performance of up to 1.3TFLOPS. It also has a wide range of I/O options, including LVDS, PCI Express, SRIO, Ethernet, and USB. It also has a wide range of configurable I/O voltages, ranging from 1.2V to 3.3V.

The XCKU085-3FLVB1760E is suitable for a variety of applications, including embedded systems, high-performance computing, image processing, communications, and networking. It is also suitable for applications in the aerospace, defense, and automotive industries. It is also well-suited for applications such as machine learning, artificial intelligence, and data analytics.

Overall, the XCKU085-3FLVB1760E is a powerful and versatile FPGA chip from Xilinx. It is capable of performing a wide range of tasks, and is suitable for a variety of applications. Its high performance and wide range of I/O options make it a great choice for a variety of projects.