
AMD Xilinx
XCKU040-3FFVA1156I
XCKU040-3FFVA1156I ECAD Model
XCKU040-3FFVA1156I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 520 | |
Number of Outputs | 520 | |
Number of Logic Cells | 530250 | |
Number of CLBs | 30300 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Organization | 30300 CLBS | |
Supply Voltage-Max | 1.03 V | |
Supply Voltage-Min | 970 mV | |
JESD-30 Code | S-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1156,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.42 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | FBGA-1156 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Date Of Intro | 2017-02-15 |
XCKU040-3FFVA1156I Datasheet Download
XCKU040-3FFVA1156I Overview
The XCKU040-3FFVA1156I chip model is a high-performance and advanced model designed for digital signal processing, embedded processing, and image processing. It is capable of performing complex and demanding tasks, making it an ideal choice for a wide range of applications. The chip model is programmed using HDL language, which allows for the development of sophisticated and efficient applications.
The XCKU040-3FFVA1156I chip model has several advantages that make it an attractive option for many industries. It is highly efficient and reliable, allowing for a longer life span than other models. It also has a low power consumption, making it ideal for applications that require low energy consumption. Additionally, the chip model is capable of performing complex tasks with high speed and accuracy, making it suitable for a variety of applications.
The XCKU040-3FFVA1156I chip model is expected to be in high demand in the future due to its advanced features and capabilities. It is likely to be used in a wide range of applications, such as medical, automotive, and communications. In addition, the chip model is expected to be used in network applications, as it is capable of handling large amounts of data with speed and accuracy. It is also likely to be used in the era of fully intelligent systems, as it is capable of performing complex tasks with precision.
The XCKU040-3FFVA1156I chip model is a highly advanced and efficient model that is capable of performing complex tasks with speed and accuracy. It is expected to be in high demand in the future due to its advanced features and capabilities. It is likely to be used in a variety of applications, such as medical, automotive, and communications, as well as networks and intelligent scenarios. The chip model is also likely to be used in the era of fully intelligent systems, as it is capable of performing complex tasks with precision.
You May Also Be Interested In
3,052 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4,542.0456 | $4,542.0456 |
10+ | $4,493.2064 | $44,932.0640 |
100+ | $4,249.0104 | $424,901.0400 |
1000+ | $4,004.8144 | $2,002,407.2000 |
10000+ | $3,662.9400 | $3,662,940.0000 |
The price is for reference only, please refer to the actual quotation! |