AMD Xilinx
XCKU035-1FBVA900C
XCKU035-1FBVA900C ECAD Model
XCKU035-1FBVA900C Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | AMD Xilinx | |
| Series | Kintex® UltraScale™ | |
| Package | Bulk | |
| Number of LABs/CLBs | 25391 | |
| Number of Logic Elements/Cells | 444343 | |
| Total RAM Bits | 19456000 | |
| Number of I/O | 468 | |
| Voltage - Supply | 0.922V ~ 0.979V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 900-BBGA, FCBGA | |
| Supplier Device Package | 900-FCBGA (31x31) | |
| Base Product Number | XCKU035 |
XCKU035-1FBVA900C Overview
The XCKU035-1FBVA900C is a FPGA chip model from Xilinx, Inc. It is a part of the Kintex UltraScale+ family and is based on a high-performance, low-power, 28nm process. It integrates a total of 35,280 logic cells and has a maximum power consumption of 15W. It is available in a 11x11mm flip-chip BGA package.
The device offers a wide range of features, including up to 4.5M system logic cells, up to 2.2M flip-flops, up to 1.1M RAM blocks, up to 7.9Tb/s of total transceiver bandwidth, up to 9.6Mb of total block RAM, and up to 2,400 DSP slices. It also supports multiple I/O standards, such as PCIe, 10/25/40/50/100G Ethernet, and more.
The XCKU035-1FBVA900C is a versatile chip model that can be used in a variety of applications, such as signal processing, machine learning, embedded vision, and more. It is ideal for high-performance, low-power applications that require high levels of integration and scalability. It is also suitable for applications in the aerospace, automotive, industrial, and medical markets.
You May Also Be Interested In
1,921 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $772.8559 | $772.8559 |
| 10+ | $764.5456 | $7,645.4558 |
| 100+ | $722.9942 | $72,299.4186 |
| 1000+ | $681.4428 | $340,721.3980 |
| 10000+ | $623.2709 | $623,270.8500 |
| The price is for reference only, please refer to the actual quotation! | ||