AMD Xilinx
XCCACE-TQ144I
XCCACE-TQ144I ECAD Model
XCCACE-TQ144I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Host Interface Standard | PCMCIA-ATA | |
| External Data Bus Width | 16 | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 2.5 V | |
| uPs/uCs/Peripheral ICs Type | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | |
| Technology | CMOS | |
| Additional Feature | ALSO OPERATES AT 3.3V SUPPLY | |
| Power Supplies | 2.5/3.3,3.3 V | |
| Supply Current-Max | 420 µA | |
| Supply Voltage-Max | 2.75 V | |
| Supply Voltage-Min | 2.25 V | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Seated Height-Max | 1.6 mm | |
| Width | 20 mm | |
| Length | 20 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | XILINX |
XCCACE-TQ144I Datasheet Download
XCCACE-TQ144I Overview
The chip model XCCACE-TQ144I is a powerful processor designed for high-performance digital signal processing, embedded processing, and image processing. This chip model is designed to be used with HDL language, which is a hardware description language used to program digital logic circuits. This chip model is designed to be flexible and powerful enough to meet the needs of various applications.
The industry trends of the chip model XCCACE-TQ144I are heavily dependent on the new technologies that are needed for its application environment. As new technologies emerge and the demands for digital signal processing, embedded processing, and image processing increase, the chip model XCCACE-TQ144I will be able to meet the needs of its application environment.
The original design intention of the chip model XCCACE-TQ144I was to be able to meet the needs of various applications. This chip model is designed to be flexible and powerful enough to handle the most demanding tasks. It is also designed to be upgradeable, so that it can keep up with the changing needs of its application environment. As new technologies emerge and the demands for digital signal processing, embedded processing, and image processing increase, the chip model XCCACE-TQ144I can be upgraded to meet the needs of its application environment.
The chip model XCCACE-TQ144I is also designed to be used in advanced communication systems. With its powerful processor and flexible design, it is capable of handling the most demanding tasks in advanced communication systems. It is also designed to be upgradeable, so that it can keep up with the changing needs of its application environment. With its powerful processor and flexible design, the chip model XCCACE-TQ144I is able to meet the needs of its application environment and the demands of advanced communication systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||