AMD Xilinx
XC95288-10BGG352C
XC95288-10BGG352C ECAD Model
XC95288-10BGG352C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 10 ns | |
| Number of I/O Lines | 192 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 192 I/O | |
| Clock Frequency-Max | 67 MHz | |
| Output Function | MACROCELL | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 352 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC95288-10BGG352C Datasheet Download
XC95288-10BGG352C Overview
The XC95288-10BGG352C chip model is an advanced integrated circuit (IC) designed by Xilinx, Inc. It is a multi-purpose and versatile device that can be used in a variety of applications. It is based on the Xilinx XC9500XL family of Field Programmable Gate Arrays (FPGAs) and is the most powerful member of this family. The XC95288-10BGG352C chip model offers a wide range of features and benefits, making it an ideal choice for a variety of applications.
The XC95288-10BGG352C chip model has a number of advantages over other similar models. It has a high level of integration, which allows it to perform multiple tasks simultaneously. This makes it a great choice for applications where multiple functions are needed in a single device. It also has a high speed, which makes it suitable for applications that require fast data processing. Additionally, the chip model is highly reliable and can be used in a variety of environments, making it suitable for a wide range of applications.
In addition to its advantages, the XC95288-10BGG352C chip model is also expected to have a strong demand in the future. As technology advances and more applications require more powerful and versatile chips, the demand for this type of chip is likely to increase. In addition, the chip model is expected to be used in a wide range of applications, including those related to communication systems, networks, and intelligent scenarios.
The original design intention of the XC95288-10BGG352C chip model was to provide a powerful and versatile device that could be used in a wide range of applications. The chip model is designed to be highly reliable and can be used in a variety of environments. It has a high level of integration and can perform multiple tasks simultaneously, making it suitable for applications where multiple functions are needed in a single device. Additionally, the chip model has a high speed, which makes it suitable for applications that require fast data processing.
In terms of future upgrades, the XC95288-10BGG352C chip model is expected to be able to keep up with the latest advancements in technology. It is likely that the chip model will be able to be upgraded to include more features and capabilities as technology advances. This would make it even more suitable for a wide range of applications.
The XC95288-10BGG352C chip model is expected to be used in a variety of applications in the future. It is likely to be used in communication systems, networks, and intelligent scenarios. It is also likely to be used in the era of fully intelligent systems, as it is designed to be highly reliable and able to perform multiple tasks simultaneously. This makes it an ideal choice for applications that require a powerful and versatile chip.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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