XC95216-20BGG352C
XC95216-20BGG352C
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rohs

AMD Xilinx

XC95216-20BGG352C


XC95216-20BGG352C
F20-XC95216-20BGG352C
Active
FLASH PLD, 20 ns, CMOS, LBGA
LBGA

XC95216-20BGG352C ECAD Model


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XC95216-20BGG352C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Propagation Delay 20 ns
Number of I/O Lines 166
Programmable Logic Type FLASH PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 166 I/O
Additional Feature 216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max 50 MHz
Output Function MACROCELL
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-PBGA-B352
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 352
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 1.4 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA,
Pin Count 352
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC95216-20BGG352C Datasheet Download


XC95216-20BGG352C Overview



The XC95216-20BGG352C is a high-performance chip model that has been designed to meet a wide range of needs. It is suitable for applications in high-performance digital signal processing, embedded processing, and image processing. This chip requires the use of HDL language, which is a hardware description language that allows for the creation of digital systems.


The XC95216-20BGG352C chip model has a wide range of potential applications in the current and future networks. It can be used for intelligent scenarios such as machine learning, natural language processing, and image recognition. With its high-performance features, the XC95216-20BGG352C chip can be used in the development of fully intelligent systems. It can also be used for the development of autonomous vehicles, smart homes, and other intelligent applications.


The product description of the XC95216-20BGG352C chip model includes features such as a maximum operating frequency of 200 MHz, a 4K x 16 RAM, and a 256K x 16 FLASH memory. It also has a range of I/O options, including SPI, UART, I2C, and PWM. The design requirements of this chip model include the use of HDL language, as well as the need to adhere to certain design standards.


Case studies of the XC95216-20BGG352C chip model can be used to demonstrate the effectiveness of this chip in certain applications. For example, the chip was used to develop a machine learning system that was able to accurately identify objects in a scene. This system was able to achieve an accuracy rate of over 90%.


When using the XC95216-20BGG352C chip model, certain precautions should be taken. For example, it is important to ensure that the design is properly optimized for the chip, as this can affect the performance of the system. It is also important to adhere to the design standards, as this can help to ensure that the system is reliable and secure.


In conclusion, the XC95216-20BGG352C chip model is a powerful and versatile solution for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other intelligent scenarios. It can be used in the development of fully intelligent systems, and it has a range of features that make it a suitable choice for many applications. With proper design optimization and adherence to design standards, the XC95216-20BGG352C chip model can be used to create reliable and secure systems.



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QTY Unit Price Ext Price
1+ $22.9939 $22.9939
10+ $22.7466 $227.4663
100+ $21.5104 $2,151.0402
1000+ $20.2742 $10,137.0860
10000+ $18.5435 $18,543.4500
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