AMD Xilinx
XC95144XV-7TQG144C
XC95144XV-7TQG144C ECAD Model
XC95144XV-7TQG144C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 7.5 ns | |
| Number of Macro Cells | 144 | |
| Number of I/O Lines | 117 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 117 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 125 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8/3.3,2.5 V | |
| Supply Voltage-Max | 2.62 V | |
| Supply Voltage-Min | 2.37 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC95144XV-7TQG144C Datasheet Download
XC95144XV-7TQG144C Overview
The XC95144XV-7TQG144C chip model is a high-performance, low-power CPLD (Complex Programmable Logic Device) from Xilinx, Inc. It is a next-generation device that combines the high-speed and low-power characteristics of FPGAs (Field Programmable Gate Arrays) with the low cost and high density of PLDs (Programmable Logic Devices). This chip model provides a wide range of features, including fast programming and debugging, high-performance logic, and a wide range of configuration options.
The XC95144XV-7TQG144C chip model is designed to be used in a variety of applications, including communications, industrial automation, consumer electronics, and automotive systems. It is also suitable for use in high-speed and low-power applications, such as high-speed data acquisition and control systems. Its low-power and low-cost features make it an ideal choice for applications that require high performance and low cost.
In terms of industry trends, the XC95144XV-7TQG144C chip model is expected to see increased demand in the future as more and more applications require high-performance and low-power solutions. Its low-cost and high-density features make it an attractive option for a wide range of applications. As the demand for high-performance and low-power solutions increases, the XC95144XV-7TQG144C chip model will become increasingly popular.
The original design intention of the XC95144XV-7TQG144C chip model was to provide a low-cost, high-performance solution for a wide range of applications. It is designed to be used in a variety of applications, including communications, industrial automation, consumer electronics, and automotive systems. Its low-power and low-cost features make it an ideal choice for applications that require high performance and low cost.
As for the possibility of future upgrades, the XC95144XV-7TQG144C chip model is designed to be upgradeable. It is designed to be able to support new technologies, such as high-speed communication protocols, as the demand for higher performance and new technologies increases. This will allow users to upgrade their systems as new technologies become available.
The XC95144XV-7TQG144C chip model is an ideal solution for a wide range of applications, including communications, industrial automation, consumer electronics, and automotive systems. Its low-power and low-cost features make it an attractive option for a wide range of applications. As the demand for high-performance and low-power solutions increases, the XC95144XV-7TQG144C chip model will become increasingly popular. Its upgradeability and ability to support new technologies make it an ideal choice for applications that require high performance and low cost.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||