AMD Xilinx
XC95144XV-7CSG144C
XC95144XV-7CSG144C ECAD Model
XC95144XV-7CSG144C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 7.5 ns | |
| Number of Macro Cells | 144 | |
| Number of I/O Lines | 117 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 117 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 125 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8/3.3,2.5 V | |
| Supply Voltage-Max | 2.62 V | |
| Supply Voltage-Min | 2.37 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC95144XV-7CSG144C Datasheet Download
XC95144XV-7CSG144C Overview
The XC95144XV-7CSG144C chip model is a high-performance, low-cost model developed by Xilinx, a leading provider of programmable logic devices. It is designed for a wide range of applications, including digital signal processing, embedded processing, image processing, and more. The chip model is especially suitable for the development of high-performance applications that require the use of HDL language.
The XC95144XV-7CSG144C chip model offers several advantages over other models. It has a small form factor, making it suitable for use in a variety of applications. It also has a wide range of configurable I/O, allowing for flexible design. Furthermore, it has a large amount of memory and logic cells, providing ample resources for complex applications.
The XC95144XV-7CSG144C chip model is expected to be in high demand in the coming years in the fields of digital signal processing, embedded processing, and image processing. As the demand for these applications increases, the XC95144XV-7CSG144C model is likely to gain popularity. It is also expected to be used in the development of advanced robots and other intelligent machines.
The XC95144XV-7CSG144C chip model can indeed be applied to the development and popularization of future intelligent robots. However, in order to use the model effectively, technical talents with knowledge of HDL language are required. These experts must be able to design, program, and debug the chip model in order to create a functional and reliable robotic system. Additionally, they must be familiar with the various features and capabilities of the XC95144XV-7CSG144C model in order to optimize its performance for the desired application.
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3,461 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $9.1895 | $9.1895 |
| 10+ | $9.0907 | $90.9070 |
| 100+ | $8.5966 | $859.6644 |
| 1000+ | $8.1026 | $4,051.2920 |
| 10000+ | $7.4109 | $7,410.9000 |
| The price is for reference only, please refer to the actual quotation! | ||