
AMD Xilinx
XC7Z100-L2FFG900I
XC7Z100-L2FFG900I ECAD Model
XC7Z100-L2FFG900I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 1 V | |
uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
Technology | CMOS | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B900 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA900,30X30,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 3.24 mm | |
Width | 27 mm | |
Length | 27 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC7Z100-L2FFG900I Datasheet Download
XC7Z100-L2FFG900I Overview
XC7Z100-L2FFG900I is a chip model designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is based on a Xilinx Zynq-7000 FPGA, which is equipped with dual-core ARM Cortex-A9 processors and a powerful FPGA logic fabric. This chip model is capable of executing complex algorithms, providing high-speed data processing, and reducing latency.
The XC7Z100-L2FFG900I has several advantages that make it suitable for use in a variety of applications. It has a high-performance FPGA logic fabric, which can perform complex operations quickly. It also has dual-core ARM Cortex-A9 processors, which are capable of running multiple tasks simultaneously. The chip model also features a wide range of peripherals, such as Gigabit Ethernet, USB, and more.
As the demand for high-performance digital signal processing, embedded processing, and image processing increases, the XC7Z100-L2FFG900I is expected to become more popular. This chip model is ideal for applications that require low latency, high throughput, and high-performance processing. It is also suitable for applications that require the use of HDL language.
When designing a product with the XC7Z100-L2FFG900I, it is important to consider the specific design requirements. These requirements may include the type of input and output signals, the clock frequency, and the power consumption of the chip model. It is also important to consider the size of the FPGA logic fabric and the number of peripherals that are available.
In order to ensure the successful implementation of a design with the XC7Z100-L2FFG900I, it is important to consider actual case studies and potential pitfalls. For example, it is important to consider the power consumption of the chip model, as it can have a significant impact on the overall performance of the design. It is also important to consider the compatibility of the peripherals with the chip model, as some peripherals may not be compatible with the FPGA logic fabric.
The XC7Z100-L2FFG900I is a powerful chip model that is suitable for a variety of applications. It has a high-performance FPGA logic fabric, dual-core ARM Cortex-A9 processors, and a wide range of peripherals. It is expected to become more popular as the demand for high-performance digital signal processing, embedded processing, and image processing increases. When designing a product with the XC7Z100-L2FFG900I, it is important to consider the specific design requirements, actual case studies, and potential pitfalls.
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5,570 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $9,065.3815 | $9,065.3815 |
10+ | $8,967.9042 | $89,679.0424 |
100+ | $8,480.5181 | $848,051.8140 |
1000+ | $7,993.1320 | $3,996,566.0200 |
10000+ | $7,310.7915 | $7,310,791.5000 |
The price is for reference only, please refer to the actual quotation! |