XC7Z100-L2FFG900I
XC7Z100-L2FFG900I
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rohs

AMD Xilinx

XC7Z100-L2FFG900I


XC7Z100-L2FFG900I
F20-XC7Z100-L2FFG900I
Active
CMOS, BGA
BGA

XC7Z100-L2FFG900I ECAD Model


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XC7Z100-L2FFG900I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B900
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 3.24 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z100-L2FFG900I Datasheet Download


XC7Z100-L2FFG900I Overview



XC7Z100-L2FFG900I is a chip model designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is based on a Xilinx Zynq-7000 FPGA, which is equipped with dual-core ARM Cortex-A9 processors and a powerful FPGA logic fabric. This chip model is capable of executing complex algorithms, providing high-speed data processing, and reducing latency.


The XC7Z100-L2FFG900I has several advantages that make it suitable for use in a variety of applications. It has a high-performance FPGA logic fabric, which can perform complex operations quickly. It also has dual-core ARM Cortex-A9 processors, which are capable of running multiple tasks simultaneously. The chip model also features a wide range of peripherals, such as Gigabit Ethernet, USB, and more.


As the demand for high-performance digital signal processing, embedded processing, and image processing increases, the XC7Z100-L2FFG900I is expected to become more popular. This chip model is ideal for applications that require low latency, high throughput, and high-performance processing. It is also suitable for applications that require the use of HDL language.


When designing a product with the XC7Z100-L2FFG900I, it is important to consider the specific design requirements. These requirements may include the type of input and output signals, the clock frequency, and the power consumption of the chip model. It is also important to consider the size of the FPGA logic fabric and the number of peripherals that are available.


In order to ensure the successful implementation of a design with the XC7Z100-L2FFG900I, it is important to consider actual case studies and potential pitfalls. For example, it is important to consider the power consumption of the chip model, as it can have a significant impact on the overall performance of the design. It is also important to consider the compatibility of the peripherals with the chip model, as some peripherals may not be compatible with the FPGA logic fabric.


The XC7Z100-L2FFG900I is a powerful chip model that is suitable for a variety of applications. It has a high-performance FPGA logic fabric, dual-core ARM Cortex-A9 processors, and a wide range of peripherals. It is expected to become more popular as the demand for high-performance digital signal processing, embedded processing, and image processing increases. When designing a product with the XC7Z100-L2FFG900I, it is important to consider the specific design requirements, actual case studies, and potential pitfalls.



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Unit Price: $9,747.722
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Pricing (USD)

QTY Unit Price Ext Price
1+ $9,065.3815 $9,065.3815
10+ $8,967.9042 $89,679.0424
100+ $8,480.5181 $848,051.8140
1000+ $7,993.1320 $3,996,566.0200
10000+ $7,310.7915 $7,310,791.5000
The price is for reference only, please refer to the actual quotation!

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