XC7Z100-L2FFG1156I
XC7Z100-L2FFG1156I
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rohs

AMD Xilinx

XC7Z100-L2FFG1156I


XC7Z100-L2FFG1156I
F20-XC7Z100-L2FFG1156I
Active
CMOS, BGA
BGA

XC7Z100-L2FFG1156I ECAD Model


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XC7Z100-L2FFG1156I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1156
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 3.1 mm
Width 35 mm
Length 35 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z100-L2FFG1156I Datasheet Download


XC7Z100-L2FFG1156I Overview



The XC7Z100-L2FFG1156I is a powerful chip model that has been developed by Xilinx, Inc. to meet the demands of high-performance applications. With its advanced features, such as its high-performance processing, low-power consumption, and small form factor, this chip model has been widely adopted by many industries.


Industry trends of the XC7Z100-L2FFG1156I chip model can be seen in the increasing demand for high-performance applications. This chip model is designed to provide the necessary performance, while also keeping power consumption and size requirements to a minimum. This makes the XC7Z100-L2FFG1156I a great choice for applications that require high performance, but have limited space and power requirements.


In terms of future development and upgrades, the XC7Z100-L2FFG1156I chip model is designed to be easily upgradable. This allows for the chip model to be used in applications that require more advanced features and technologies. As such, it can be used in advanced communication systems, such as 5G networks, as well as in other high-performance applications.


The product description and design requirements of the XC7Z100-L2FFG1156I chip model are quite comprehensive. It is designed to provide high-performance processing, low-power consumption, and small form factor. The chip model also supports various memory types, such as DDR2, DDR3, and DDR4, as well as a variety of I/O standards, such as USB, PCIe, and Ethernet.


In terms of actual case studies, the XC7Z100-L2FFG1156I chip model has been used in many applications, including industrial automation, medical imaging, and automotive applications. Additionally, the chip model has been used in many 5G networks, as it is capable of providing the necessary performance, while also keeping power consumption and size requirements to a minimum.


Finally, when using the XC7Z100-L2FFG1156I chip model, there are a few precautions to keep in mind. For example, proper cooling and ventilation should be considered when using the chip model, as it is designed to operate at high temperatures. Additionally, users should ensure that the chip model is properly grounded, as this will help to reduce the risk of electrical shock.


Overall, the XC7Z100-L2FFG1156I chip model is a powerful and reliable choice for high-performance applications. With its advanced features and upgradability, it is suitable for a variety of applications, including 5G networks and industrial automation. Additionally, the product description and design requirements of the chip model are comprehensive, and actual case studies have shown its effectiveness in various applications. Finally, it is important to keep in mind a few precautions when using the XC7Z100-L2FFG1156I chip model, such as proper cooling and grounding.



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Unit Price: $2,181.8226
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,029.0950 $2,029.0950
10+ $2,007.2768 $20,072.7679
100+ $1,898.1857 $189,818.5662
1000+ $1,789.0945 $894,547.2660
10000+ $1,636.3670 $1,636,366.9500
The price is for reference only, please refer to the actual quotation!

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