
AMD Xilinx
XC7Z100-2FFG900I
XC7Z100-2FFG900I ECAD Model
XC7Z100-2FFG900I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 1 V | |
uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
Technology | CMOS | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B900 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA900,30X30,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 3.24 mm | |
Width | 27 mm | |
Length | 27 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | FBGA-900 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC7Z100-2FFG900I Datasheet Download
XC7Z100-2FFG900I Overview
The XC7Z100-2FFG900I chip model is a powerful and versatile tool for developing and deploying modern networks and intelligent systems. It is designed to provide a platform for the development of innovative, next-generation intelligent systems, and its applications are only limited by the imagination of the user.
The XC7Z100-2FFG900I chip model features a 900-pin BGA package and is based on the Xilinx 7-series FPGA architecture. It has a wide range of features, including high-speed transceivers, large memory blocks, and a wide range of I/O options. It is capable of supporting a wide range of applications, from high-speed communications to high-performance computing.
The XC7Z100-2FFG900I chip model can be used in a variety of intelligent scenarios, including autonomous vehicles, robotics, machine learning, and artificial intelligence. It is also capable of supporting the development and popularization of future intelligent robots, as it provides a reliable platform for the development of sophisticated robotic systems.
In addition, the XC7Z100-2FFG900I chip model is highly versatile and can be used in a variety of applications. It is capable of supporting high-speed communications and high-performance computing, making it an ideal platform for the development of innovative, next-generation intelligent systems. It is also capable of supporting the development and popularization of future intelligent robots, as it provides a reliable platform for the development of sophisticated robotic systems.
In order to use the XC7Z100-2FFG900I chip model effectively, it is important to understand its product description and design requirements. It is also important to take into account the actual case studies and precautions when using the chip model. Technical talents are also needed in order to use the model effectively. These include knowledge of programming languages such as Verilog, VHDL, and C/C++, as well as knowledge of FPGA design and development.
In conclusion, the XC7Z100-2FFG900I chip model is a powerful and versatile tool for developing and deploying modern networks and intelligent systems. It is capable of supporting a wide range of applications, from high-speed communications to high-performance computing, making it an ideal platform for the development and popularization of future intelligent robots. In order to use the XC7Z100-2FFG900I chip model effectively, it is important to understand its product description and design requirements, as well as take into account the actual case studies and precautions when using the chip model. Technical talents are also needed in order to use the model effectively.
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3,562 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $167.3913 | $167.3913 |
10+ | $165.5914 | $1,655.9135 |
100+ | $156.5918 | $15,659.1822 |
1000+ | $147.5923 | $73,796.1460 |
10000+ | $134.9930 | $134,992.9500 |
The price is for reference only, please refer to the actual quotation! |