XC7Z100-2FFG900I
XC7Z100-2FFG900I
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rohs

AMD Xilinx

XC7Z100-2FFG900I


XC7Z100-2FFG900I
F20-XC7Z100-2FFG900I
Active
CMOS, FBGA-900
FBGA-900

XC7Z100-2FFG900I ECAD Model


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XC7Z100-2FFG900I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B900
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 3.24 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description FBGA-900
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z100-2FFG900I Datasheet Download


XC7Z100-2FFG900I Overview



The XC7Z100-2FFG900I chip model is a powerful and versatile tool for developing and deploying modern networks and intelligent systems. It is designed to provide a platform for the development of innovative, next-generation intelligent systems, and its applications are only limited by the imagination of the user.


The XC7Z100-2FFG900I chip model features a 900-pin BGA package and is based on the Xilinx 7-series FPGA architecture. It has a wide range of features, including high-speed transceivers, large memory blocks, and a wide range of I/O options. It is capable of supporting a wide range of applications, from high-speed communications to high-performance computing.


The XC7Z100-2FFG900I chip model can be used in a variety of intelligent scenarios, including autonomous vehicles, robotics, machine learning, and artificial intelligence. It is also capable of supporting the development and popularization of future intelligent robots, as it provides a reliable platform for the development of sophisticated robotic systems.


In addition, the XC7Z100-2FFG900I chip model is highly versatile and can be used in a variety of applications. It is capable of supporting high-speed communications and high-performance computing, making it an ideal platform for the development of innovative, next-generation intelligent systems. It is also capable of supporting the development and popularization of future intelligent robots, as it provides a reliable platform for the development of sophisticated robotic systems.


In order to use the XC7Z100-2FFG900I chip model effectively, it is important to understand its product description and design requirements. It is also important to take into account the actual case studies and precautions when using the chip model. Technical talents are also needed in order to use the model effectively. These include knowledge of programming languages such as Verilog, VHDL, and C/C++, as well as knowledge of FPGA design and development.


In conclusion, the XC7Z100-2FFG900I chip model is a powerful and versatile tool for developing and deploying modern networks and intelligent systems. It is capable of supporting a wide range of applications, from high-speed communications to high-performance computing, making it an ideal platform for the development and popularization of future intelligent robots. In order to use the XC7Z100-2FFG900I chip model effectively, it is important to understand its product description and design requirements, as well as take into account the actual case studies and precautions when using the chip model. Technical talents are also needed in order to use the model effectively.



3,562 In Stock


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Unit Price: $179.9906
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $167.3913 $167.3913
10+ $165.5914 $1,655.9135
100+ $156.5918 $15,659.1822
1000+ $147.5923 $73,796.1460
10000+ $134.9930 $134,992.9500
The price is for reference only, please refer to the actual quotation!

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