AMD Xilinx
XC7Z100-2FFG900E
XC7Z100-2FFG900E ECAD Model
XC7Z100-2FFG900E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B900 | |
| Operating Temperature-Max | 100 °C | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.24 mm | |
| Width | 27 mm | |
| Length | 27 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA-900 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 |
XC7Z100-2FFG900E Datasheet Download
XC7Z100-2FFG900E Overview
The chip model XC7Z100-2FFG900E has been designed to provide exceptional performance and versatility for a range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other advanced applications. The chip is designed to be used in conjunction with HDL (Hardware Description Language) for programming and development.
The original design intention of the XC7Z100-2FFG900E was to provide a powerful and reliable platform for a wide range of applications. The chip is designed to be upgradable, allowing for future improvements and enhancements. This makes the XC7Z100-2FFG900E an ideal choice for advanced communication systems.
The XC7Z100-2FFG900E is also suitable for the development and popularization of future intelligent robots. The chip has the necessary power and flexibility to handle complex tasks and can be used to create robots with advanced capabilities. To use the XC7Z100-2FFG900E effectively, technical expertise in HDL programming and development is necessary. In addition, knowledge of robotics, artificial intelligence, and other related fields is also beneficial.
In conclusion, the XC7Z100-2FFG900E is a powerful and versatile chip model that can be used for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other advanced applications. The chip is designed to be used in conjunction with HDL for programming and development, and it is also suitable for the development and popularization of future intelligent robots. To use the XC7Z100-2FFG900E effectively, technical expertise in HDL programming and development is necessary.
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4,283 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,452.5742 | $2,452.5742 |
| 10+ | $2,426.2025 | $24,262.0247 |
| 100+ | $2,294.3436 | $229,434.3642 |
| 1000+ | $2,162.4848 | $1,081,242.4060 |
| 10000+ | $1,977.8825 | $1,977,882.4500 |
| The price is for reference only, please refer to the actual quotation! | ||