XC7Z100-2FFG1156I
XC7Z100-2FFG1156I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC7Z100-2FFG1156I


XC7Z100-2FFG1156I
F20-XC7Z100-2FFG1156I
Active
CMOS, BGA
BGA

XC7Z100-2FFG1156I ECAD Model


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XC7Z100-2FFG1156I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1156
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 3.1 mm
Width 35 mm
Length 35 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z100-2FFG1156I Datasheet Download


XC7Z100-2FFG1156I Overview



XC7Z100-2FFG1156I is a chip model that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language that allows for the efficient creation of complex digital components.


The XC7Z100-2FFG1156I chip model offers a range of advantages for its users. It is designed to be highly reliable and efficient, and it is capable of performing complex tasks with minimal energy consumption. Additionally, the chip model is designed to be highly scalable, meaning that users can easily upgrade their hardware as their needs evolve. This scalability also makes it an ideal choice for a variety of applications, including those in the industrial and automotive sectors.


The XC7Z100-2FFG1156I chip model is designed to meet specific design requirements. It is capable of interfacing with a variety of peripherals, including USB, Ethernet, and serial ports. Additionally, the chip model is designed to be easily programmable, meaning that users can quickly and easily make changes to the chip's software.


When designing a project with the XC7Z100-2FFG1156I chip model, there are a few things to keep in mind. First, users should ensure that the chip is properly powered and cooled. Additionally, users should pay special attention to the timing of the chip's design, as this will affect the performance of the chip. Finally, users should also be aware of the potential for electrical interference, as this can affect the performance of the chip.


The XC7Z100-2FFG1156I chip model is expected to be in high demand in the coming years, as the need for reliable and efficient embedded processing and digital signal processing continues to grow. With its scalability and reliability, the chip model is an ideal choice for a variety of applications. Additionally, with its ease of programmability, users can quickly and easily customize their hardware to meet their specific needs.



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Unit Price: $11,404.8994
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Pricing (USD)

QTY Unit Price Ext Price
1+ $10,606.5564 $10,606.5564
10+ $10,492.5074 $104,925.0745
100+ $9,922.2625 $992,226.2478
1000+ $9,352.0175 $4,676,008.7540
10000+ $8,553.6746 $8,553,674.5500
The price is for reference only, please refer to the actual quotation!

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