AMD Xilinx
XC7Z100-1FFG900C
XC7Z100-1FFG900C ECAD Model
XC7Z100-1FFG900C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B900 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.24 mm | |
| Width | 27 mm | |
| Length | 27 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 |
XC7Z100-1FFG900C Datasheet Download
XC7Z100-1FFG900C Overview
The XC7Z100-1FFG900C chip model is a high-performance, low-cost model that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. This chip model is also capable of using HDL (Hardware Description Language) which is a powerful programming language used to design and simulate digital systems.
The XC7Z100-1FFG900C chip model offers many advantages, such as low cost, low power consumption, and high performance. Additionally, this chip model is designed to be compatible with a wide range of applications and is suitable for both commercial and industrial applications. As the demand for high-performance, low-cost models increases, the XC7Z100-1FFG900C is expected to become even more popular.
The XC7Z100-1FFG900C chip model is also capable of being used in networks and for intelligent applications. This chip model can be used for applications such as voice recognition, facial recognition, and natural language processing. Additionally, this chip model can be used in the era of fully intelligent systems, such as autonomous vehicles and smart homes.
Overall, the XC7Z100-1FFG900C chip model is a powerful, low-cost model that is suitable for a wide range of applications. This chip model is capable of using HDL, is low power consumption, and is designed to be compatible with a wide range of applications. Additionally, this chip model is capable of being used in networks and for intelligent applications, and can be used in the era of fully intelligent systems.
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3,233 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,300.5263 | $2,300.5263 |
| 10+ | $2,275.7895 | $22,757.8946 |
| 100+ | $2,152.1053 | $215,210.5254 |
| 1000+ | $2,028.4210 | $1,014,210.5220 |
| 10000+ | $1,855.2632 | $1,855,263.1500 |
| The price is for reference only, please refer to the actual quotation! | ||