AMD Xilinx
XC7Z045-L2FFG900I
XC7Z045-L2FFG900I ECAD Model
XC7Z045-L2FFG900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B900 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.24 mm | |
| Width | 27 mm | |
| Length | 27 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA-900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7Z045-L2FFG900I Datasheet Download
XC7Z045-L2FFG900I Overview
The XC7Z045-L2FFG900I chip model is a revolutionary new product from the leading semiconductor manufacturer Xilinx. It is a highly integrated, high-performance, low-power, and cost-effective FPGA chip. It is designed to meet the needs of today’s high-speed, high-performance, and low-power applications.
The XC7Z045-L2FFG900I chip model is equipped with a powerful Zynq UltraScale+ MPSoC processor, which provides a high-performance, low-power, and cost-efficient solution for the most demanding applications. It also features a large number of configurable logic blocks, high-speed transceivers, and memory interfaces. The combination of these features makes the XC7Z045-L2FFG900I chip model a powerful platform for a wide variety of applications.
The XC7Z045-L2FFG900I chip model is expected to be in high demand in the coming years due to its high performance, low power, and cost-effectiveness. It is ideal for applications in the fields of industrial automation, medical, automotive, aerospace, and communications. It is also expected to be used in the Internet of Things (IoT) and other advanced communication systems.
The XC7Z045-L2FFG900I chip model is designed to be easily upgradable for future applications. It is capable of handling large amounts of data and can be used for a variety of intelligent scenarios. It is also capable of supporting advanced communication systems and networks, and can be used in the era of fully intelligent systems.
The XC7Z045-L2FFG900I chip model is a powerful and versatile platform that can be used in a variety of applications. It is expected to be in high demand in the coming years due to its high performance, low power, and cost-effectiveness. It is capable of handling large amounts of data and can be used for a variety of intelligent scenarios. It is also capable of supporting advanced communication systems and networks, and can be used in the era of fully intelligent systems. With its upgradable design, the XC7Z045-L2FFG900I chip model is a great choice for those looking to take advantage of the latest technology.
You May Also Be Interested In
4,386 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $8,302.3632 | $8,302.3632 |
| 10+ | $8,213.0905 | $82,130.9052 |
| 100+ | $7,766.7269 | $776,672.6901 |
| 1000+ | $7,320.3633 | $3,660,181.6430 |
| 10000+ | $6,695.4542 | $6,695,454.2250 |
| The price is for reference only, please refer to the actual quotation! | ||