AMD Xilinx
XC7Z045-L2FFG676I
XC7Z045-L2FFG676I ECAD Model
XC7Z045-L2FFG676I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B676 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.24 mm | |
| Width | 27 mm | |
| Length | 27 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7Z045-L2FFG676I Datasheet Download
XC7Z045-L2FFG676I Overview
The chip model XC7Z045-L2FFG676I is a high-performance chip manufactured by Xilinx, Inc. It is a powerful FPGA with the highest performance of any FPGA on the market. This chip model is designed to meet the needs of the most demanding applications, such as high-speed networking, video processing, and embedded systems.
The XC7Z045-L2FFG676I chip model has many advantages over other FPGAs. It is capable of processing data at a high speed, making it ideal for applications that require a high level of performance. It also has a low power consumption, making it suitable for use in many different types of environments. Furthermore, the chip model is designed to be highly reliable, making it a great choice for applications that require a high level of reliability.
The XC7Z045-L2FFG676I chip model is expected to be in high demand in the near future. This is due to the fact that the chip model is capable of providing a high level of performance and reliability. This makes it ideal for use in a variety of applications, such as high-speed networking, video processing, and embedded systems. As more applications require a higher level of performance and reliability, the demand for this chip model is expected to increase.
In terms of the future applications of the XC7Z045-L2FFG676I chip model, it is likely that it will be used in a variety of networks and intelligent scenarios. This is due to the fact that the chip model is capable of providing a high level of performance and reliability. It is also likely that the chip model will be used in the era of fully intelligent systems, as it is capable of processing data quickly and efficiently.
The XC7Z045-L2FFG676I chip model is a powerful FPGA that is capable of providing a high level of performance and reliability. It is expected to be in high demand in the near future due to its capabilities. It is also likely that the chip model will be used in a variety of networks and intelligent scenarios, as well as in the era of fully intelligent systems. This makes it an ideal choice for applications that require a high level of performance and reliability.
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4,238 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $293.3188 | $293.3188 |
| 10+ | $290.1649 | $2,901.6487 |
| 100+ | $274.3950 | $27,439.5042 |
| 1000+ | $258.6252 | $129,312.6060 |
| 10000+ | $236.5475 | $236,547.4500 |
| The price is for reference only, please refer to the actual quotation! | ||