XC7Z045-L2FBG676I
XC7Z045-L2FBG676I
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rohs

AMD Xilinx

XC7Z045-L2FBG676I


XC7Z045-L2FBG676I
F20-XC7Z045-L2FBG676I
Active
CMOS, BGA
BGA

XC7Z045-L2FBG676I ECAD Model


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XC7Z045-L2FBG676I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B676
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 2.54 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z045-L2FBG676I Datasheet Download


XC7Z045-L2FBG676I Overview



The XC7Z045-L2FBG676I chip model is a highly advanced and powerful device that is ideal for a range of applications. It is well-suited for high-performance digital signal processing, embedded processing, image processing, and other applications. To use this chip model effectively, it requires the use of HDL language, which is a hardware description language used to program and design digital systems.


The XC7Z045-L2FBG676I chip model is a powerful device that is capable of handling a wide range of tasks. It has a 7-series FPGA architecture with a 676 I/O pins, making it suitable for a variety of applications. The chip model has a high-performance processing capability, which makes it ideal for digital signal processing, embedded processing, and image processing. It also supports a wide range of programming languages, including Verilog, VHDL, and SystemVerilog.


When it comes to product description and specific design requirements, the XC7Z045-L2FBG676I chip model has a wide range of features. It is equipped with a Xilinx 7-series FPGA architecture with a 676 I/O pins, and it supports a wide range of programming languages. Additionally, it is designed with a high-performance processing capability and supports a range of digital signal processing, embedded processing, and image processing applications.


In terms of actual case studies and precautions, the XC7Z045-L2FBG676I chip model has been used in a variety of applications. It has been used in medical imaging, video processing, and communication systems. Additionally, it has been used in a variety of industrial applications, such as factory automation, machine vision, and robotics.


When it comes to the development and popularization of future intelligent robots, the XC7Z045-L2FBG676I chip model can be applied. It is equipped with a high-performance processing capability and supports a wide range of programming languages, making it suitable for a range of applications. However, the effective use of this chip model requires the use of HDL language, which is a hardware description language used to program and design digital systems. Therefore, it is necessary to have technical expertise in HDL language in order to use the XC7Z045-L2FBG676I chip model effectively.



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Unit Price: $1,530.88
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,423.7184 $1,423.7184
10+ $1,408.4096 $14,084.0960
100+ $1,331.8656 $133,186.5600
1000+ $1,255.3216 $627,660.8000
10000+ $1,148.1600 $1,148,160.0000
The price is for reference only, please refer to the actual quotation!

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