AMD Xilinx
XC7Z045-3FFG900E
XC7Z045-3FFG900E ECAD Model
XC7Z045-3FFG900E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B900 | |
| Operating Temperature-Max | 100 °C | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.24 mm | |
| Width | 27 mm | |
| Length | 27 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA-900 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7Z045-3FFG900E Datasheet Download
XC7Z045-3FFG900E Overview
The chip model XC7Z045-3FFG900E is a high-performance, low-cost FPGA (Field Programmable Gate Array) device developed by Xilinx. It is suitable for a wide range of applications, including advanced communication systems, intelligent robots and other related fields. It has a wide range of features, including a powerful XtremeDSP engine, high-speed transceivers, and advanced memory interfaces.
The original design intention of the chip model XC7Z045-3FFG900E is to provide a cost-effective solution for customers who need to deploy high-performance FPGA devices. It is designed to be flexible and easily upgradeable, allowing customers to take advantage of the latest advancements in FPGA technology. The device also features a wide range of I/O options, making it suitable for a variety of applications.
As for industry trends, the chip model XC7Z045-3FFG900E is expected to continue to be a popular choice for customers. It is likely to remain a cost-effective solution for customers who need to deploy high-performance FPGA devices. The device is also expected to remain a popular choice for customers who need to deploy advanced communication systems, intelligent robots and other related fields.
As for the future development of related industries, the chip model XC7Z045-3FFG900E is expected to remain a popular choice. It is likely that new technologies will be required to support the application environment of the device. This could include new algorithms, software, and hardware. It is also likely that the device will need to be upgraded to take advantage of the latest advancements in FPGA technology.
Finally, the chip model XC7Z045-3FFG900E can be applied to the development and popularization of future intelligent robots. In order to do this, technical talents with knowledge of FPGA technology and experience in developing intelligent robots will be required. This could include software engineers, hardware engineers, and roboticists. With the right technical talent, the chip model XC7Z045-3FFG900E can be used to develop the next generation of intelligent robots.
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2,629 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $8,301.2195 | $8,301.2195 |
| 10+ | $8,211.9591 | $82,119.5910 |
| 100+ | $7,765.6570 | $776,565.6975 |
| 1000+ | $7,319.3549 | $3,659,677.4250 |
| 10000+ | $6,694.5319 | $6,694,531.8750 |
| The price is for reference only, please refer to the actual quotation! | ||