
AMD Xilinx
XC7Z045-3FFG676E
XC7Z045-3FFG676E ECAD Model
XC7Z045-3FFG676E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 1 V | |
uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
Technology | CMOS | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B676 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 3.24 mm | |
Width | 27 mm | |
Length | 27 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC7Z045-3FFG676E Datasheet Download
XC7Z045-3FFG676E Overview
The XC7Z045-3FFG676E chip model is a powerful solution for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with a hardware description language (HDL) to enable hardware designs to be created and simulated before being implemented in the real world.
The original design of the XC7Z045-3FFG676E chip model was intended to facilitate the development of complex and advanced applications. The chip model is equipped with a wide range of features, such as a high-performance processor, high-speed memory, and a variety of communication interfaces, making it an ideal choice for a wide range of tasks. The chip model also has the potential to be upgraded in the future, allowing it to be used for more complex tasks and applications.
The XC7Z045-3FFG676E chip model can be applied to advanced communication systems, networks, and intelligent scenarios. It is capable of handling a variety of data types and can be used for a wide range of tasks. It is also capable of supporting the development of fully intelligent systems, allowing it to be used in the era of fully intelligent systems.
In conclusion, the XC7Z045-3FFG676E chip model is a powerful solution for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with a hardware description language (HDL) and is capable of handling a variety of data types and tasks. It is also capable of being upgraded in the future and can be applied to advanced communication systems, networks, and intelligent scenarios. This makes it an ideal choice for a wide range of tasks and applications in the era of fully intelligent systems.
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2,051 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $293.3188 | $293.3188 |
10+ | $290.1649 | $2,901.6487 |
100+ | $274.3950 | $27,439.5042 |
1000+ | $258.6252 | $129,312.6060 |
10000+ | $236.5475 | $236,547.4500 |
The price is for reference only, please refer to the actual quotation! |