XC7Z045-3FFG676E
XC7Z045-3FFG676E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC7Z045-3FFG676E


XC7Z045-3FFG676E
F20-XC7Z045-3FFG676E
Active
CMOS, BGA
BGA

XC7Z045-3FFG676E ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XC7Z045-3FFG676E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B676
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 3.24 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z045-3FFG676E Datasheet Download


XC7Z045-3FFG676E Overview



The XC7Z045-3FFG676E chip model is a powerful solution for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with a hardware description language (HDL) to enable hardware designs to be created and simulated before being implemented in the real world.


The original design of the XC7Z045-3FFG676E chip model was intended to facilitate the development of complex and advanced applications. The chip model is equipped with a wide range of features, such as a high-performance processor, high-speed memory, and a variety of communication interfaces, making it an ideal choice for a wide range of tasks. The chip model also has the potential to be upgraded in the future, allowing it to be used for more complex tasks and applications.


The XC7Z045-3FFG676E chip model can be applied to advanced communication systems, networks, and intelligent scenarios. It is capable of handling a variety of data types and can be used for a wide range of tasks. It is also capable of supporting the development of fully intelligent systems, allowing it to be used in the era of fully intelligent systems.


In conclusion, the XC7Z045-3FFG676E chip model is a powerful solution for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with a hardware description language (HDL) and is capable of handling a variety of data types and tasks. It is also capable of being upgraded in the future and can be applied to advanced communication systems, networks, and intelligent scenarios. This makes it an ideal choice for a wide range of tasks and applications in the era of fully intelligent systems.



2,051 In Stock


I want to buy

Unit Price: $315.3966
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $293.3188 $293.3188
10+ $290.1649 $2,901.6487
100+ $274.3950 $27,439.5042
1000+ $258.6252 $129,312.6060
10000+ $236.5475 $236,547.4500
The price is for reference only, please refer to the actual quotation!

Quick Quote