XC7Z045-2FFG676I
XC7Z045-2FFG676I
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rohs

AMD Xilinx

XC7Z045-2FFG676I


XC7Z045-2FFG676I
F20-XC7Z045-2FFG676I
Active
CMOS, FBGA-676
FBGA-676

XC7Z045-2FFG676I ECAD Model


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XC7Z045-2FFG676I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B676
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 3.24 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description FBGA-676
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z045-2FFG676I Datasheet Download


XC7Z045-2FFG676I Overview



The chip model XC7Z045-2FFG676I is a high-performance, multi-purpose chip that is suitable for a variety of applications. It is designed for high-performance digital signal processing, embedded processing, image processing, and other such tasks that require the use of HDL language. The chip model is designed to provide the highest performance possible, while still being able to fit into a wide range of applications.


The advantages of the XC7Z045-2FFG676I chip model include its high-performance capabilities, its low power consumption, and its ability to fit into a wide range of applications. The chip model also has a wide range of features, including an integrated memory controller, multiple clock domains, and a wide range of I/O options. The chip model also has a wide range of configurable options, making it easy to customize for specific applications.


The expected demand for the XC7Z045-2FFG676I chip model is expected to increase in the future. This is due to the increasing need for high-performance digital signal processing, embedded processing, and image processing tasks. As more applications begin to require the use of HDL language, the demand for the XC7Z045-2FFG676I chip model is expected to increase.


The product description of the XC7Z045-2FFG676I chip model includes its high-performance capabilities, its low power consumption, and its ability to fit into a wide range of applications. The chip model also has a wide range of features, including an integrated memory controller, multiple clock domains, and a wide range of I/O options. The chip model also has a wide range of configurable options, making it easy to customize for specific applications.


When designing with the XC7Z045-2FFG676I chip model, there are a few things to keep in mind. First, it is important to ensure that the chip model is compatible with the application that it is being used for. Second, it is important to ensure that the chip model is able to handle the data rate and processing power that the application requires. Finally, it is important to ensure that the chip model is able to fit into the size constraints of the application.


To demonstrate the capabilities of the XC7Z045-2FFG676I chip model, a few case studies have been conducted. In one case study, the chip model was used to develop a high-performance, low-power image processing system. In another case study, the chip model was used to develop a low-power, high-performance embedded processor. In both cases, the chip model was able to meet the performance and power requirements of the applications.


Overall, the XC7Z045-2FFG676I chip model is an excellent choice for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to provide the highest performance possible, while still being able to fit into a wide range of applications. The chip model also has a wide range of features, including an integrated memory controller, multiple clock domains, and a wide range of I/O options. Finally, when designing with the XC7Z045-2FFG676I chip model, it is important to ensure that the chip model is compatible with the application, is able to handle the data rate and processing power that the application requires, and is able to fit into the size constraints of the application.



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Unit Price: $223.9498
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Pricing (USD)

QTY Unit Price Ext Price
1+ $208.2733 $208.2733
10+ $206.0338 $2,060.3382
100+ $194.8363 $19,483.6326
1000+ $183.6388 $91,819.4180
10000+ $167.9624 $167,962.3500
The price is for reference only, please refer to the actual quotation!

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