
AMD Xilinx
XC7Z045-2FFG676I
XC7Z045-2FFG676I ECAD Model
XC7Z045-2FFG676I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 1 V | |
uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
Technology | CMOS | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B676 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 3.24 mm | |
Width | 27 mm | |
Length | 27 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | FBGA-676 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC7Z045-2FFG676I Datasheet Download
XC7Z045-2FFG676I Overview
The chip model XC7Z045-2FFG676I is a high-performance, multi-purpose chip that is suitable for a variety of applications. It is designed for high-performance digital signal processing, embedded processing, image processing, and other such tasks that require the use of HDL language. The chip model is designed to provide the highest performance possible, while still being able to fit into a wide range of applications.
The advantages of the XC7Z045-2FFG676I chip model include its high-performance capabilities, its low power consumption, and its ability to fit into a wide range of applications. The chip model also has a wide range of features, including an integrated memory controller, multiple clock domains, and a wide range of I/O options. The chip model also has a wide range of configurable options, making it easy to customize for specific applications.
The expected demand for the XC7Z045-2FFG676I chip model is expected to increase in the future. This is due to the increasing need for high-performance digital signal processing, embedded processing, and image processing tasks. As more applications begin to require the use of HDL language, the demand for the XC7Z045-2FFG676I chip model is expected to increase.
The product description of the XC7Z045-2FFG676I chip model includes its high-performance capabilities, its low power consumption, and its ability to fit into a wide range of applications. The chip model also has a wide range of features, including an integrated memory controller, multiple clock domains, and a wide range of I/O options. The chip model also has a wide range of configurable options, making it easy to customize for specific applications.
When designing with the XC7Z045-2FFG676I chip model, there are a few things to keep in mind. First, it is important to ensure that the chip model is compatible with the application that it is being used for. Second, it is important to ensure that the chip model is able to handle the data rate and processing power that the application requires. Finally, it is important to ensure that the chip model is able to fit into the size constraints of the application.
To demonstrate the capabilities of the XC7Z045-2FFG676I chip model, a few case studies have been conducted. In one case study, the chip model was used to develop a high-performance, low-power image processing system. In another case study, the chip model was used to develop a low-power, high-performance embedded processor. In both cases, the chip model was able to meet the performance and power requirements of the applications.
Overall, the XC7Z045-2FFG676I chip model is an excellent choice for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to provide the highest performance possible, while still being able to fit into a wide range of applications. The chip model also has a wide range of features, including an integrated memory controller, multiple clock domains, and a wide range of I/O options. Finally, when designing with the XC7Z045-2FFG676I chip model, it is important to ensure that the chip model is compatible with the application, is able to handle the data rate and processing power that the application requires, and is able to fit into the size constraints of the application.
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1,151 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $208.2733 | $208.2733 |
10+ | $206.0338 | $2,060.3382 |
100+ | $194.8363 | $19,483.6326 |
1000+ | $183.6388 | $91,819.4180 |
10000+ | $167.9624 | $167,962.3500 |
The price is for reference only, please refer to the actual quotation! |