XC7Z045-2FBG676E
XC7Z045-2FBG676E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC7Z045-2FBG676E


XC7Z045-2FBG676E
F20-XC7Z045-2FBG676E
Active
CMOS, BGA
BGA

XC7Z045-2FBG676E ECAD Model


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XC7Z045-2FBG676E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B676
Operating Temperature-Max 100 °C
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 2.54 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z045-2FBG676E Datasheet Download


XC7Z045-2FBG676E Overview



The XC7Z045-2FBG676E chip model is a powerful and versatile component that is designed to meet the needs of many industries. It is a powerful, high-performance, low-power FPGA device that is suitable for a wide range of applications. It is designed to provide a high level of performance, flexibility, and scalability while minimizing power consumption and cost.


The XC7Z045-2FBG676E chip model is ideal for use in many areas, including networking and communications, automotive, industrial, and medical applications. It has a wide range of features, such as high-speed transceivers, high-speed logic, and high-performance DSP blocks. It also supports a variety of I/O standards, including LVDS, USB, Gigabit Ethernet, and CAN. It has the ability to support multiple clock domains and can be used for both synchronous and asynchronous designs.


The XC7Z045-2FBG676E chip model is expected to be in high demand in the future due to its versatility and its ability to meet the needs of many industries. It is expected to be used in a variety of applications, including networks, automotive, industrial, and medical applications. It is also expected to be used in the development of intelligent systems, such as autonomous vehicles and robots.


In terms of applications in networks, the XC7Z045-2FBG676E chip model is ideal for use in intelligent scenarios, such as machine learning, image processing, and natural language processing. It is also capable of supporting multiple clock domains and can be used for both synchronous and asynchronous designs. It is also suitable for use in the development of 5G networks and other high-speed networks.


The XC7Z045-2FBG676E chip model is also suitable for use in the development and popularization of future intelligent robots. It has the ability to process large amounts of data quickly and accurately and can be used to build complex robotic systems. It is also capable of supporting multiple clock domains and can be used for both synchronous and asynchronous designs.


In order to use the XC7Z045-2FBG676E chip model effectively, technical talents with knowledge of FPGA design, embedded systems, and software development are required. They must also have a good understanding of the various I/O standards, such as LVDS, USB, Gigabit Ethernet, and CAN. Additionally, they must be familiar with the various machine learning algorithms and image processing techniques that are used in the development of intelligent systems.



5,434 In Stock


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Unit Price: $805.9507
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $749.5342 $749.5342
10+ $741.4746 $7,414.7464
100+ $701.1771 $70,117.7109
1000+ $660.8796 $330,439.7870
10000+ $604.4630 $604,463.0250
The price is for reference only, please refer to the actual quotation!

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