AMD Xilinx
XC7Z045-1FFG676C
XC7Z045-1FFG676C ECAD Model
XC7Z045-1FFG676C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B676 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.24 mm | |
| Width | 27 mm | |
| Length | 27 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7Z045-1FFG676C Datasheet Download
XC7Z045-1FFG676C Overview
The Xilinx XC7Z045-1FFG676C chip model is a revolutionary technology that has been designed to meet the needs of the modern day. It is a highly advanced, high-performance, and low-power programmable system on chip (SoC) that has been designed to meet the needs of a wide range of applications. It is a multi-processor system on chip (MPSoC) that combines a powerful processor, a high performance FPGA, and a range of peripherals and interfaces.
The Xilinx XC7Z045-1FFG676C chip model is designed to provide a high level of performance and power efficiency, while providing a wide range of features and capabilities. It is a highly integrated platform that offers a range of features and capabilities, such as high-speed DDR3 memory, Ethernet and USB connectivity, and a wide range of peripherals and interfaces. It also features a low-power design and low-power consumption, making it ideal for applications in a wide range of industries and applications.
The Xilinx XC7Z045-1FFG676C chip model is designed to meet the needs of a wide range of applications, from consumer electronics to industrial automation. It is also designed to be easily upgradeable, so that it can be used for future upgrades and applications. It is also designed to be compatible with a wide range of communication systems, such as Wi-Fi, Bluetooth, and Zigbee.
The Xilinx XC7Z045-1FFG676C chip model is designed to provide a wide range of features and capabilities, while also providing a high level of performance and power efficiency. It is designed to be easily upgradeable, so that it can be used for future upgrades and applications. The chip model is also designed to be compatible with a wide range of communication systems, making it ideal for applications in a wide range of industries and applications. With its high level of performance and power efficiency, the Xilinx XC7Z045-1FFG676C chip model is expected to be in high demand in the future, as more applications and technologies require its capabilities.
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3,394 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $968.0796 | $968.0796 |
| 10+ | $957.6701 | $9,576.7014 |
| 100+ | $905.6228 | $90,562.2846 |
| 1000+ | $853.5756 | $426,787.7780 |
| 10000+ | $780.7094 | $780,709.3500 |
| The price is for reference only, please refer to the actual quotation! | ||