XC7Z045-1FBG676I
XC7Z045-1FBG676I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC7Z045-1FBG676I


XC7Z045-1FBG676I
F20-XC7Z045-1FBG676I
Active
CMOS, BGA
BGA

XC7Z045-1FBG676I ECAD Model


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XC7Z045-1FBG676I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B676
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 2.54 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z045-1FBG676I Datasheet Download


XC7Z045-1FBG676I Overview



The XC7Z045-1FBG676I chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language and is already being used in various industries. But what about its future applications? What new technologies will it require, and what new intelligent scenarios can it be used in?


The XC7Z045-1FBG676I chip model is well-suited for use in networks, and its potential applications are wide-ranging. It can be used for data processing, image processing, and machine learning. It can also be used in smart home systems and autonomous vehicles. In the future, this chip model will be used in more and more intelligent scenarios, such as natural language processing, computer vision, and robotics.


To meet the demands of the future, the XC7Z045-1FBG676I chip model will need to be supported by new technologies. These could include 5G networks, artificial intelligence, and the Internet of Things. With the help of these technologies, the chip model will be able to perform more complex tasks and be used in more intelligent scenarios.


The XC7Z045-1FBG676I chip model is already a powerful tool for digital signal processing, embedded processing, and image processing. But its future applications are even more exciting. With the help of new technologies, this chip model will be able to power fully intelligent systems and be used in a variety of intelligent scenarios. The possibilities are endless.



5,486 In Stock


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Unit Price: $306.5466
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $285.0883 $285.0883
10+ $282.0229 $2,820.2287
100+ $266.6955 $26,669.5542
1000+ $251.3682 $125,684.1060
10000+ $229.9100 $229,909.9500
The price is for reference only, please refer to the actual quotation!

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