AMD Xilinx
XC7Z045-1FBG676CES
XC7Z045-1FBG676CES ECAD Model
XC7Z045-1FBG676CES Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B676 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.54 mm | |
| Width | 27 mm | |
| Length | 27 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 |
XC7Z045-1FBG676CES Datasheet Download
XC7Z045-1FBG676CES Overview
The chip model XC7Z045-1FBG676CES is a highly advanced microprocessor designed to provide high-performance computing capabilities. It is manufactured by Xilinx, a leading provider of programmable logic components. The chip has a wide range of applications, including industrial automation, robotics, and communications. It is also capable of supporting the development of artificial intelligence and machine learning technologies.
The chip model XC7Z045-1FBG676CES is designed to provide high-performance computing capabilities, allowing for the development of advanced communication systems and applications. Its original design intention was to provide a platform for the development of future intelligent robots. It is capable of providing the necessary computing power to support the development and popularization of future intelligent robots.
The chip model XC7Z045-1FBG676CES is designed to be highly compatible with existing technologies, making it easy to integrate into existing systems. It is also capable of supporting the development of new technologies, such as machine learning and artificial intelligence. In order to use the chip model effectively, it requires technical talents with a deep understanding of the chip’s architecture and capabilities.
The industry trends of the chip model XC7Z045-1FBG676CES will depend on the specific technologies needed by its application environment. The chip model is capable of supporting the development of new technologies, making it suitable for use in advanced communication systems and other applications. It is also capable of providing the necessary computing power to support the development and popularization of future intelligent robots.
The chip model XC7Z045-1FBG676CES is capable of providing the necessary computing power for existing technologies as well as for the development of new technologies. Its original design intention was to provide a platform for the development of future intelligent robots. It is also capable of supporting the development of advanced communication systems and other applications. The future development of related industries and whether the application environment requires the support of new technologies will depend on what specific technologies are needed. In order to use the chip model effectively, it requires technical talents with a deep understanding of the chip’s architecture and capabilities.
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5,749 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $861.7603 | $861.7603 |
| 10+ | $852.4941 | $8,524.9408 |
| 100+ | $806.1629 | $80,616.2880 |
| 1000+ | $759.8317 | $379,915.8400 |
| 10000+ | $694.9680 | $694,968.0000 |
| The price is for reference only, please refer to the actual quotation! | ||