XC7Z045-1FBG676C
XC7Z045-1FBG676C
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rohs

AMD Xilinx

XC7Z045-1FBG676C


XC7Z045-1FBG676C
F20-XC7Z045-1FBG676C
Active
CMOS, FBGA-676
FBGA-676

XC7Z045-1FBG676C ECAD Model


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XC7Z045-1FBG676C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B676
Operating Temperature-Max 85 °C
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 2.54 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description FBGA-676
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z045-1FBG676C Datasheet Download


XC7Z045-1FBG676C Overview



The Xilinx XC7Z045-1FBG676C chip model is a powerful, versatile device that has been designed to meet the needs of a wide range of industries. It is an advanced FPGA chip that offers a variety of features and capabilities, including high-speed processing, low power consumption, and a large number of I/O pins. The chip model is ideal for applications such as data acquisition, communication, and multimedia processing.


The XC7Z045-1FBG676C chip model is built on a 45nm process, which provides a high degree of integration and performance. It features a wide range of I/O pins, allowing it to be used in a variety of applications. The chip model is also capable of supporting a variety of high-speed interfaces, including PCIe, DDR3, and USB. Additionally, the device offers a range of features, such as high-speed transceivers, clock management, and power management.


The XC7Z045-1FBG676C chip model is expected to be in high demand in the coming years, as it offers a wide range of features and capabilities that can be used in a variety of industries. For example, the chip model can be used in medical imaging and monitoring, automotive, industrial, and consumer applications. Additionally, the chip model can be used in the development of advanced robotics and artificial intelligence.


When considering the application environment for the XC7Z045-1FBG676C chip model, it is important to consider the specific technologies that are needed to support the application. For example, if the application requires high-speed data transfer, then the chip model must be designed to support the necessary interface. Additionally, if the application requires low power consumption, then the chip model must be designed to meet the power requirements. It is also important to consider the specific design requirements of the chip model, such as the number of I/O pins, the clock speed, and the power management features.


In order to ensure the successful implementation of the XC7Z045-1FBG676C chip model, it is important to consider actual case studies and use caution when designing the device. For example, it is important to consider the power requirements of the device, as well as the specific design requirements. Additionally, it is important to consider potential issues, such as electromagnetic interference, which can affect the performance of the chip model.


Overall, the XC7Z045-1FBG676C chip model is a powerful and versatile device that can be used in a variety of industries. It is expected to be in high demand in the coming years, as it offers a wide range of features and capabilities. When considering the application environment for the chip model, it is important to consider the specific technologies that are needed to support the application, as well as the specific design requirements. Additionally, it is important to consider actual case studies and use caution when designing the device.



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Unit Price: $749.1067
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Pricing (USD)

QTY Unit Price Ext Price
1+ $696.6692 $696.6692
10+ $689.1782 $6,891.7816
100+ $651.7228 $65,172.2829
1000+ $614.2675 $307,133.7470
10000+ $561.8300 $561,830.0250
The price is for reference only, please refer to the actual quotation!

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