
AMD Xilinx
XC7Z035-L2FFG900I
XC7Z035-L2FFG900I ECAD Model
XC7Z035-L2FFG900I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 1 V | |
uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SYSTEM ON CHIP | |
Technology | CMOS | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B900 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA900,30X30,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 3.35 mm | |
Width | 31 mm | |
Length | 31 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC7Z035-L2FFG900I Datasheet Download
XC7Z035-L2FFG900I Overview
The chip model XC7Z035-L2FFG900I is a cutting-edge integrated circuit (IC) designed to provide a high-performance computing platform for a wide range of applications. It features a high-speed, low-power, and versatile architecture that can be used in a variety of applications. It is designed to provide the best possible performance while still being cost-effective.
The XC7Z035-L2FFG900I is a highly advanced chip model that can be used in a variety of applications. It is designed to be used in advanced communication systems as well as in networks and intelligent systems. The chip model is capable of supporting a wide range of technologies, including high-speed internet connectivity, wireless communication, and advanced data processing.
The chip model is also designed to be able to handle the latest trends and developments in the industry. It is capable of supporting the latest technologies, such as artificial intelligence (AI) and machine learning, as well as other emerging technologies. This makes it an ideal choice for applications in the era of fully intelligent systems.
The chip model is also designed to be upgradeable and customizable to suit the needs of the user. This allows users to keep up with the latest trends and developments in the industry and to ensure that their systems are always up to date. It also allows for future upgrades, such as adding new features or improving existing ones.
Overall, the XC7Z035-L2FFG900I is a highly advanced chip model that can be used in a variety of applications. It is designed to provide the best possible performance while still being cost-effective. It is capable of supporting the latest technologies and is upgradeable and customizable to suit the needs of the user. This makes it an ideal choice for applications in the era of fully intelligent systems.
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3,412 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $6,848.5233 | $6,848.5233 |
10+ | $6,774.8833 | $67,748.8331 |
100+ | $6,406.6831 | $640,668.3132 |
1000+ | $6,038.4830 | $3,019,241.4760 |
10000+ | $5,523.0027 | $5,523,002.7000 |
The price is for reference only, please refer to the actual quotation! |