XC7Z035-L2FFG900I
XC7Z035-L2FFG900I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC7Z035-L2FFG900I


XC7Z035-L2FFG900I
F20-XC7Z035-L2FFG900I
Active
CMOS, BGA
BGA

XC7Z035-L2FFG900I ECAD Model


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XC7Z035-L2FFG900I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B900
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 3.35 mm
Width 31 mm
Length 31 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z035-L2FFG900I Datasheet Download


XC7Z035-L2FFG900I Overview



The chip model XC7Z035-L2FFG900I is a cutting-edge integrated circuit (IC) designed to provide a high-performance computing platform for a wide range of applications. It features a high-speed, low-power, and versatile architecture that can be used in a variety of applications. It is designed to provide the best possible performance while still being cost-effective.


The XC7Z035-L2FFG900I is a highly advanced chip model that can be used in a variety of applications. It is designed to be used in advanced communication systems as well as in networks and intelligent systems. The chip model is capable of supporting a wide range of technologies, including high-speed internet connectivity, wireless communication, and advanced data processing.


The chip model is also designed to be able to handle the latest trends and developments in the industry. It is capable of supporting the latest technologies, such as artificial intelligence (AI) and machine learning, as well as other emerging technologies. This makes it an ideal choice for applications in the era of fully intelligent systems.


The chip model is also designed to be upgradeable and customizable to suit the needs of the user. This allows users to keep up with the latest trends and developments in the industry and to ensure that their systems are always up to date. It also allows for future upgrades, such as adding new features or improving existing ones.


Overall, the XC7Z035-L2FFG900I is a highly advanced chip model that can be used in a variety of applications. It is designed to provide the best possible performance while still being cost-effective. It is capable of supporting the latest technologies and is upgradeable and customizable to suit the needs of the user. This makes it an ideal choice for applications in the era of fully intelligent systems.



3,412 In Stock


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Unit Price: $7,364.0036
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $6,848.5233 $6,848.5233
10+ $6,774.8833 $67,748.8331
100+ $6,406.6831 $640,668.3132
1000+ $6,038.4830 $3,019,241.4760
10000+ $5,523.0027 $5,523,002.7000
The price is for reference only, please refer to the actual quotation!

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