XC7Z035-L2FFG676I
XC7Z035-L2FFG676I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC7Z035-L2FFG676I


XC7Z035-L2FFG676I
F20-XC7Z035-L2FFG676I
Active
CMOS, BGA
BGA

XC7Z035-L2FFG676I ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XC7Z035-L2FFG676I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B676
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 3.24 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z035-L2FFG676I Datasheet Download


XC7Z035-L2FFG676I Overview



The XC7Z035-L2FFG676I chip model is a high-performance, low-power FPGA that has been designed with a wide range of applications in mind. It is suitable for use in advanced communication systems and can be used to develop and popularize future intelligent robots.


The original design intention of the XC7Z035-L2FFG676I was to provide a flexible, low-power solution for a wide range of applications, from embedded systems to high-end communication systems. It is designed to provide a cost-effective solution for a wide range of applications, including high-speed serial communication, digital signal processing, and image processing. The chip model is also designed to be upgradeable, allowing for future upgrades as technology advances.


In terms of product description and specific design requirements, the XC7Z035-L2FFG676I is a high-performance FPGA with a low power consumption of only 6.7 W. It features a wide range of I/O options, including up to 36 LVDS pairs, up to 12 GTH transceivers, and up to 7 PCIe Gen2 x8 lanes. The chip also features a low-latency, low-jitter clock management system, which provides the flexibility required for advanced communication systems.


In terms of actual case studies, the XC7Z035-L2FFG676I has been used in a variety of applications, from embedded systems to high-end communication systems. For example, it has been used in the development of a high-speed communication system for an automotive application, as well as in the development of a high-speed data acquisition system for a medical application.


In terms of precautions, users of the XC7Z035-L2FFG676I should be aware that the chip model is sensitive to temperature and voltage variations, and should be handled with care. It is also important to ensure that the chip is properly powered and that all connections are secure.


Finally, the XC7Z035-L2FFG676I can be used to develop and popularize future intelligent robots, provided that the user has the necessary technical knowledge and experience. In order to use this chip model effectively, users will need to have a good understanding of FPGA programming and design, as well as a good understanding of digital signal processing, image processing, and high-speed serial communication. With the right technical knowledge and experience, users of the XC7Z035-L2FFG676I can develop and popularize future intelligent robots.



4,335 In Stock


I want to buy

Unit Price: $16.3977
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $15.2499 $15.2499
10+ $15.0859 $150.8588
100+ $14.2660 $1,426.5999
1000+ $13.4461 $6,723.0570
10000+ $12.2983 $12,298.2750
The price is for reference only, please refer to the actual quotation!

Quick Quote