AMD Xilinx
XC7Z035-3FFG900E
XC7Z035-3FFG900E ECAD Model
XC7Z035-3FFG900E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 1 V | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SYSTEM ON CHIP | |
| Technology | CMOS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B900 | |
| Operating Temperature-Max | 100 °C | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.35 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7Z035-3FFG900E Datasheet Download
XC7Z035-3FFG900E Overview
The XC7Z035-3FFG900E chip model is a versatile and powerful device, designed to provide high performance in digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) language, allowing users to create and customize their own designs.
The XC7Z035-3FFG900E chip model offers a range of advantages that make it an attractive choice for many industries. It has a low power consumption, making it ideal for applications that require minimal energy usage. It also offers a wide range of features, including high-speed memory, a high-speed interface, and a wide range of I/O options. Furthermore, the chip model is designed to be highly reliable, with a long life span.
The XC7Z035-3FFG900E chip model is expected to be in high demand in the future, as more industries look to leverage its capabilities. It is likely to be used in a variety of applications, such as industrial automation, medical imaging, and automotive systems. It could also be used in networks, where it could be used to process data or provide secure communications.
In the era of fully intelligent systems, the XC7Z035-3FFG900E chip model could be used to power a variety of intelligent scenarios. It could be used to power autonomous vehicles, robotics, and smart home systems. It could also be used in artificial intelligence applications, such as natural language processing and facial recognition. Furthermore, it could be used in the Internet of Things, allowing devices to communicate with each other and with the cloud.
Overall, the XC7Z035-3FFG900E chip model is a powerful and versatile device, offering a range of advantages for many industries. It is expected to be in high demand in the future, and could be used in a variety of applications, including industrial automation, medical imaging, and automotive systems. In the era of fully intelligent systems, it could be used to power a variety of intelligent scenarios, including autonomous vehicles, robotics, and smart home systems.
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5,199 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $151.1561 | $151.1561 |
| 10+ | $149.5307 | $1,495.3073 |
| 100+ | $141.4041 | $14,140.4058 |
| 1000+ | $133.2774 | $66,638.6940 |
| 10000+ | $121.9001 | $121,900.0500 |
| The price is for reference only, please refer to the actual quotation! | ||