XC7Z035-3FFG676E
XC7Z035-3FFG676E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC7Z035-3FFG676E


XC7Z035-3FFG676E
F20-XC7Z035-3FFG676E
Active
CMOS, BGA
BGA

XC7Z035-3FFG676E ECAD Model


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XC7Z035-3FFG676E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B676
Operating Temperature-Max 100 °C
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 3.24 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z035-3FFG676E Datasheet Download


XC7Z035-3FFG676E Overview



XC7Z035-3FFG676E is a chip model that is suitable for high-performance digital signal processing, embedded processing, image processing, etc. It requires the use of HDL language. This chip model has a wide range of applications, from basic digital signal processing to advanced communication systems.


XC7Z035-3FFG676E was designed with the intention of being able to be upgraded in the future, allowing for more advanced applications. With the development of technology, the chip model can be applied to more intelligent scenarios, such as network applications. It can be used in the era of fully intelligent systems, enabling the development of smarter and more efficient systems.


The chip model is designed with a high-performance architecture, with features such as high-speed signal processing, low-power operation, and a wide range of peripheral options. Its main purpose is to provide a platform for the development of advanced communication systems. It has the ability to process complex signals, enabling the development of advanced applications.


In addition, the chip model is also suitable for image processing, as it is capable of processing large amounts of data quickly and efficiently. It is also capable of handling complex algorithms, allowing for the development of advanced image processing applications.


The chip model XC7Z035-3FFG676E is an excellent choice for those looking for a powerful and reliable chip model for their applications. It is capable of handling complex tasks and can be used in a variety of scenarios. With its high-performance architecture and wide range of peripheral options, it is an ideal choice for those looking to develop advanced communication systems or image processing applications.



5,080 In Stock


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Unit Price: $6,403.1826
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $5,954.9598 $5,954.9598
10+ $5,890.9280 $58,909.2799
100+ $5,570.7689 $557,076.8862
1000+ $5,250.6097 $2,625,304.8660
10000+ $4,802.3870 $4,802,386.9500
The price is for reference only, please refer to the actual quotation!

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