XC7Z035-3FBG676E
XC7Z035-3FBG676E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC7Z035-3FBG676E


XC7Z035-3FBG676E
F20-XC7Z035-3FBG676E
Active
CMOS, BGA
BGA

XC7Z035-3FBG676E ECAD Model


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XC7Z035-3FBG676E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B676
Operating Temperature-Max 100 °C
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 2.54 mm
Width 27 mm
Length 27 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z035-3FBG676E Datasheet Download


XC7Z035-3FBG676E Overview



The XC7Z035-3FBG676E chip model is a powerful and versatile processor that is suitable for a wide range of applications. It is primarily used for high-performance digital signal processing, embedded processing, and image processing and requires the use of HDL language. This chip model is a great choice for those who need to build high-performance systems quickly and efficiently.


The development of the chip model XC7Z035-3FBG676E and related industries will depend on the specific technologies needed. As technology advances, the chip model will be able to handle more complex tasks and processes. This could include applications in networks and intelligent scenarios, such as the use of artificial intelligence and machine learning.


The chip model XC7Z035-3FBG676E is an important part of the future of intelligent systems. It is capable of handling complex tasks and processes, and can be used to power intelligent systems. This could include the use of natural language processing, image recognition, and other advanced technologies. The chip model is also capable of handling large amounts of data, making it an ideal choice for those looking to build intelligent systems.


The chip model XC7Z035-3FBG676E is a powerful and versatile processor that is suitable for a wide range of applications. As technology advances, the chip model will be able to handle more complex tasks and processes. This could include applications in networks and intelligent scenarios, such as the use of artificial intelligence and machine learning. It is capable of handling large amounts of data, making it an ideal choice for those looking to build intelligent systems. With its high-performance capabilities and its ability to use HDL language, the XC7Z035-3FBG676E chip model is a great choice for those who need to build high-performance systems quickly and efficiently.



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Unit Price: $1,129.5594
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,050.4902 $1,050.4902
10+ $1,039.1946 $10,391.9465
100+ $982.7167 $98,271.6678
1000+ $926.2387 $463,119.3540
10000+ $847.1696 $847,169.5500
The price is for reference only, please refer to the actual quotation!

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