XC7Z035-2FFG900I
XC7Z035-2FFG900I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC7Z035-2FFG900I


XC7Z035-2FFG900I
F20-XC7Z035-2FFG900I
Active
CMOS, BGA
BGA

XC7Z035-2FFG900I ECAD Model


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XC7Z035-2FFG900I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 1 V
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SYSTEM ON CHIP
Technology CMOS
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B900
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 3.35 mm
Width 31 mm
Length 31 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7Z035-2FFG900I Datasheet Download


XC7Z035-2FFG900I Overview



The XC7Z035-2FFG900I chip model is a highly advanced integrated circuit developed by Xilinx, a leading technology company in the field of programmable logic devices. It is a powerful, low-power FPGA (Field Programmable Gate Array) that provides a wide range of capabilities for designing and implementing complex digital systems. This chip model is ideal for applications that require high performance, flexibility, and scalability, such as those found in advanced communication systems, intelligent robots, and embedded systems.


The XC7Z035-2FFG900I chip model is designed to meet the needs of the most demanding applications. It is capable of delivering high levels of performance, flexibility, and scalability, making it a great choice for applications that require complex digital processing. Additionally, the chip model is designed to be compatible with a wide range of technologies, including high-speed communications protocols and embedded systems. This makes it a great choice for applications that require the use of new technologies and the development of advanced communication systems.


The chip model is also designed to be easily upgradable, so it can be used to create new applications and technologies as they become available. This makes it an ideal choice for applications that require the use of new technologies and the development of advanced communication systems. Additionally, the chip model is designed to be compatible with a wide range of technologies, including high-speed communications protocols and embedded systems. This makes it a great choice for applications that require the use of new technologies and the development of advanced communication systems.


The XC7Z035-2FFG900I chip model is also suitable for use in the development and popularization of future intelligent robots. It is capable of delivering high levels of performance, flexibility, and scalability, making it a great choice for applications that require complex digital processing. Additionally, the chip model is designed to be compatible with a wide range of technologies, including high-speed communications protocols and embedded systems. This makes it a great choice for applications that require the use of new technologies and the development of advanced communication systems.


In order to effectively use the XC7Z035-2FFG900I chip model, technical talents with expertise in digital circuit design, embedded systems, and communications protocols are needed. Additionally, knowledge of programming languages such as VHDL and Verilog is also beneficial. Furthermore, experience with Xilinx tools and FPGA design is also highly desirable. With the right technical talents and expertise, the XC7Z035-2FFG900I chip model can be used to create new applications and technologies as they become available.


In conclusion, the XC7Z035-2FFG900I chip model is a highly advanced integrated circuit developed by Xilinx. It is capable of delivering high levels of performance, flexibility, and scalability, making it a great choice for applications that require complex digital processing. Additionally, the chip model is designed to be compatible with a wide range of technologies, including high-speed communications protocols and embedded systems. This makes it a great choice for applications that require the use of new technologies and the development of advanced communication systems. The chip model is also suitable for use in the development and popularization of future intelligent robots. In order to effectively use the XC7Z035-2FFG900I chip model, technical talents with expertise in digital circuit design, embedded systems, and communications protocols are needed. With the right technical talents and expertise, the XC7Z035-2FFG900I chip model can be used to create new applications and technologies as they become available.



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Unit Price: $113.302
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $105.3709 $105.3709
10+ $104.2378 $1,042.3784
100+ $98.5727 $9,857.2740
1000+ $92.9076 $46,453.8200
10000+ $84.9765 $84,976.5000
The price is for reference only, please refer to the actual quotation!

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