
AMD Xilinx
XC7Z035-2FFG900I
XC7Z035-2FFG900I ECAD Model
XC7Z035-2FFG900I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 1 V | |
uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SYSTEM ON CHIP | |
Technology | CMOS | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B900 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA900,30X30,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 3.35 mm | |
Width | 31 mm | |
Length | 31 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC7Z035-2FFG900I Datasheet Download
XC7Z035-2FFG900I Overview
The XC7Z035-2FFG900I chip model is a highly advanced integrated circuit developed by Xilinx, a leading technology company in the field of programmable logic devices. It is a powerful, low-power FPGA (Field Programmable Gate Array) that provides a wide range of capabilities for designing and implementing complex digital systems. This chip model is ideal for applications that require high performance, flexibility, and scalability, such as those found in advanced communication systems, intelligent robots, and embedded systems.
The XC7Z035-2FFG900I chip model is designed to meet the needs of the most demanding applications. It is capable of delivering high levels of performance, flexibility, and scalability, making it a great choice for applications that require complex digital processing. Additionally, the chip model is designed to be compatible with a wide range of technologies, including high-speed communications protocols and embedded systems. This makes it a great choice for applications that require the use of new technologies and the development of advanced communication systems.
The chip model is also designed to be easily upgradable, so it can be used to create new applications and technologies as they become available. This makes it an ideal choice for applications that require the use of new technologies and the development of advanced communication systems. Additionally, the chip model is designed to be compatible with a wide range of technologies, including high-speed communications protocols and embedded systems. This makes it a great choice for applications that require the use of new technologies and the development of advanced communication systems.
The XC7Z035-2FFG900I chip model is also suitable for use in the development and popularization of future intelligent robots. It is capable of delivering high levels of performance, flexibility, and scalability, making it a great choice for applications that require complex digital processing. Additionally, the chip model is designed to be compatible with a wide range of technologies, including high-speed communications protocols and embedded systems. This makes it a great choice for applications that require the use of new technologies and the development of advanced communication systems.
In order to effectively use the XC7Z035-2FFG900I chip model, technical talents with expertise in digital circuit design, embedded systems, and communications protocols are needed. Additionally, knowledge of programming languages such as VHDL and Verilog is also beneficial. Furthermore, experience with Xilinx tools and FPGA design is also highly desirable. With the right technical talents and expertise, the XC7Z035-2FFG900I chip model can be used to create new applications and technologies as they become available.
In conclusion, the XC7Z035-2FFG900I chip model is a highly advanced integrated circuit developed by Xilinx. It is capable of delivering high levels of performance, flexibility, and scalability, making it a great choice for applications that require complex digital processing. Additionally, the chip model is designed to be compatible with a wide range of technologies, including high-speed communications protocols and embedded systems. This makes it a great choice for applications that require the use of new technologies and the development of advanced communication systems. The chip model is also suitable for use in the development and popularization of future intelligent robots. In order to effectively use the XC7Z035-2FFG900I chip model, technical talents with expertise in digital circuit design, embedded systems, and communications protocols are needed. With the right technical talents and expertise, the XC7Z035-2FFG900I chip model can be used to create new applications and technologies as they become available.
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5,719 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $105.3709 | $105.3709 |
10+ | $104.2378 | $1,042.3784 |
100+ | $98.5727 | $9,857.2740 |
1000+ | $92.9076 | $46,453.8200 |
10000+ | $84.9765 | $84,976.5000 |
The price is for reference only, please refer to the actual quotation! |